Electronics Forum | Fri May 15 12:01:34 EDT 1998 | Justin
| | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | We have
Electronics Forum | Thu May 14 21:46:27 EDT 1998 | D.Lange
| Hello. | 1 Could anyone tell me the range of temperature | to solder MI components? The process eng is using 400~500 | degrees Celcius!! For standard 0805/0603 chips & TH components & | also to touch up on ICs. What is the con
Electronics Forum | Thu May 07 21:25:56 EDT 1998 | D.Lange
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
Electronics Forum | Thu May 07 13:22:37 EDT 1998 | Chrys
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
Electronics Forum | Thu May 07 10:09:24 EDT 1998 | Cunli Jia @ SMTnet
| I thought this was a forum for equipment only. We were asked to take OUR messages off of the other SMTNet forum. I see many messages concerning process related issues that don't have anything to do about buying, selling or servicing SMT equipment
Electronics Forum | Wed May 06 15:05:00 EDT 1998 | Justin Medernach
| | Dear Freinds, | | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOX
Electronics Forum | Wed May 06 09:16:51 EDT 1998 | justin medernach
| I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and eventua
Electronics Forum | Fri May 15 09:07:12 EDT 1998 | Earl Moon
| | I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and event
Electronics Forum | Wed Apr 29 07:46:52 EDT 1998 | Scott Davies
We would like to add another pick and place machine to the SMT line. We're low volume so we change the line over after each group of boards. So far we've pretty much ruled out Siplace in favor of the Universal machines. Does anyone care to share the
Electronics Forum | Thu Apr 30 20:41:52 EDT 1998 | Dave
| We would like to add another pick and place machine to | the SMT line. We're low volume so we change the line over | after each group of boards. So far we've pretty much | ruled out Siplace in favor of the Universal machines. | Does anyone care to
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