Electronics Forum: parts (Page 1036 of 1117)

DFM gerber tool

Electronics Forum | Thu Aug 25 11:33:32 EDT 2005 | slthomas

I suppose it depends on your layout software. My weak recollection of what PowerPCB does is allow you to set up rules as far as spacing and where parts are placed, then you run the rule check, er something like that. As far as "Also what I"m thinkin

Reflow Oven Selection

Electronics Forum | Sat Aug 27 12:45:44 EDT 2005 | Mark

Thanks for the replies. Interesting white paper. Didn't quite answer my concerns but still a good read. I was actually surprised that to test temperature uniformity across the zone, they attached T/C's to the substrate rather than measure the ai

Reflow Oven Selection

Electronics Forum | Wed Aug 31 10:26:24 EDT 2005 | Carmichael

I respectfully disagree with vapor phase or reflow oven being the technology of choice here. Have you considered straight conduction heating? (ie: hot plate) If you have a lot of these to do you can purchase in-line conduction ovens like the Sikama o

Mydata Hydra and 0201 components

Electronics Forum | Fri Sep 02 07:38:13 EDT 2005 | DannyJ

Hi Mike, I haven't tried the 0201s with a Hyrda, but after seeing 20 reviews of your message without a response, I'll try and share my experience with 0402s on a non-Hydra machine. The 0402s are slow, but I managed to get some speed by maxing out

WEEE & ROHS Compliant or not ? (manipulating tool)

Electronics Forum | Tue Oct 11 05:52:04 EDT 2005 | GS

I know this could not be an SMT thread, but in certain way it impacts the PCB/PCBAs Assemblers. Hello everybody, who could help me please to identify if this tool Mmust be or Not compliant with the WEEE and ROHS Eu Directives ? I can define

Gel Flex Support

Electronics Forum | Wed Nov 02 21:50:23 EST 2005 | KEN

I beta tested these 6 months before general availability. These devices worked well in some situations and mrginally in others. Migrating to Gel may depend on what your current issues are with your current tooling solutions. Generally speaking it w

cap size and copper thickness vs part size questions

Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey

Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Thu Jan 05 11:23:49 EST 2006 | samir

Grant I'm gonna have to go ahead and sort of disagree with you there. The studies that I've been reading from various BGA Manufacturers have identified insufficient homogenizing / coalescing of the Sn/Pb Paste with the SnAgCu balls. Ball not touchi

How to disable feeder slots

Electronics Forum | Fri Dec 09 17:57:16 EST 2005 | mika

cameras > P2P (Part to Pad looking camera or upper looking camera) > front or rear >> select the corresponding camera that You have installed. After that: just save and follow the instructions on the screeen. By the way, an important thing is: You M

Fine Pitch Stencil Design

Electronics Forum | Wed Dec 14 08:08:42 EST 2005 | Champ Kind

Snaggletooth, I spent a good portion of my career fighting solder shorts on BGA's and QFP's, tombstones on 0402's, solderballs on passives, etc.. I've solved just about all those issues, and didn't solely rely on my stencil manufacturer... Your ste


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