11167 parts results

Electronics Forum: parts (Page 106 of 1117)

Component price database - which or how?

Electronics Forum | Mon Aug 31 09:33:28 EDT 2009 | jamyboy

You can save your boms and Partminer will let you search that data along with capturing what you paid last time the time before and maybe if there are any opportunities to get the part cheaper somewhere else. Helps us keep track of the parts we have

Reject Rate

Electronics Forum | Mon Nov 16 01:35:15 EST 2009 | chandika

for reject rate depends on various parameters, Part data parameters, (Body tolerance,Part pickup & transport speed etc. ) Also depend on vaccum level, ( During the PM we need to messure pickup nozzle vaccumlevel using manometer ) According to raw mat

BGA Resistor Array Separating from Balls

Electronics Forum | Tue Jan 19 09:45:06 EST 2010 | pcbrookie

You nailed it. After some further investigation, it appears we had some old Pb version of this part that never got scrapped. Corrective action has been taken, and all the Pb parts have been disposed of. It makes sense that this would happen to the

detecting BGA micro cracks

Electronics Forum | Thu Feb 11 08:14:41 EST 2010 | scottp

It's OK to have the daisychain done in the interposer rather than the die (and a lot cheaper) but in thermal cycling the parts MUST have representative die. That's where a large part of the CTE mismatch comes from to cause fatigue damage. Thermal c

Line Capacity

Electronics Forum | Mon Jul 12 16:28:36 EDT 2010 | rway

That said, having some sort of buffer to meet demand in case of machine downtime will probably be your best bet. It doesn't hurt to have spare parts on hand to mimimize downtime either. We do both. With some parts it may be economically unfeasable

Peel Back Force

Electronics Forum | Wed Aug 25 12:13:40 EDT 2010 | remullis

You may want to search on "Cover Tape", what date code is on the parts reel? I have multiple issues with cover tape sticking to the paper and not peeling back. Causes pick errors due to the part being covered. I think my problem is the parts have too

Voiding in LGA (LT) soldering

Electronics Forum | Wed Sep 01 05:29:40 EDT 2010 | arjan

We baked the parts just before assembly. 2>we baked the parts and store them in 4 days in drycab (60degC, Rh0,5%)and finally assembly 3> we baked the parts and refowed them on a leadfree profile and finally the assembly on the boards. The same we als

Soldering contaminated leads?

Electronics Forum | Tue Oct 05 18:05:56 EDT 2010 | jry74

I have seen an increase in components with contaminated leads, mostly SMT parts. They give us solder wetting problems and insufficient solder joints. Our practice is to not use them and return them to the manufacturer. Are these parts solderable?