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Electronics Forum | Thu May 01 12:46:19 EDT 2008 | dphilbrick
Thanks for the link Samir. Although this thread does have some good info in it I don't think it is hitting the exact point I am trying to resolve. This seems to talk to a one profile fits all for running lead and lead free paste. I want to know about
Electronics Forum | Thu May 01 10:51:09 EDT 2008 | realchunks
You need a paste designed specifically for this. They are available. Most have 2% silver in them and higher temp flux so you can reflow at "no-lead" temps. The silver aids in the intermaetalic bond and the high temp flux allows you to reflow the n
Electronics Forum | Fri May 02 16:20:35 EDT 2008 | rwyman
We've never, to my knowledge, sent out Pb-free BGAs to be reballed for use on an SnPb assembly. In fact, we developed an in-house reballing process and we haven't felt the need to do that either (for salvaging an occasional reworked part, maybe).
Electronics Forum | Wed Jun 04 00:28:27 EDT 2008 | chrispy1963
There are a couple of things that you can do. First thing to do is take a flashlight and shine it in the card edge connector of slot 2 and see if a passive component or any other part worked its way into that slot. This will cause multiple leads in
Electronics Forum | Mon Jun 09 18:43:54 EDT 2008 | mowens
Hello everyone, I'm a long time reader of the forums but this will be my first time posting and seeking help. Here's our situation, we have a small pick and place it places about 1800 parts per hour. It is a good R/D proto machine, but it is quic
Electronics Forum | Thu Jul 03 08:50:15 EDT 2008 | rgduval
We include it as a part of overhead in our costing. However, I'm working to change that....we're a fairly small job-shop, and we run some jobs where we find that final inspection takes as long as the job took to build in the first place. In these i
Electronics Forum | Thu Sep 11 11:45:33 EDT 2008 | swag
Never did find a fool proof solution. Solderability seemed O.K. (at least using the methods we have available in house). Tinned parts and placed by hand and saw little improvement. Pad design is slightly different than recommended but likely not i
Electronics Forum | Wed Aug 20 08:23:36 EDT 2008 | davef
Your tantalum capacitor supplier offers the best advice. We're not sure of the package that you plan to use. * If you are referring to molded package, surface mount, tantalum caps, yes, they can be wave soldered. Smaller case size chips (eg, Kemet A
Electronics Forum | Mon Aug 18 15:03:38 EDT 2008 | awegener
I'd like to get more information about pick and place nozzles. How can I learn more? ... What do the nozzles look like? Are there different shapes? Are custom nozzles sometimes used for custom parts or are the nozzles mostly standardized? What kind
Electronics Forum | Wed Aug 27 14:38:20 EDT 2008 | rgduval
Does your paste provider recommend a TAL? For the leaded and lead-free pastes that we use, the manufacturer recommends 60 seconds above liquidous. I note that your profile shows the TAL as 30 seconds, which may not be sufficient. That said, tho
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