Electronics Forum | Thu Aug 08 10:58:18 EDT 2002 | Tom Gervascio
I'm interested in sharing any information on bumping of LAnd Grid Array (i.e. QFN) packages. due to PCB contraints, it's not possible to stencil paste onto sites for QFNs. That lead to a lot of experimentation with bumping of 6 mm QFN packages.In sum
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Electronics Forum | Thu Apr 18 14:22:39 EDT 2002 | eedllc
I agree with Steve Huey, as a former Field Engineer and Asian Customer service manager living in Hong Kong for almost 10 years with little blue, there has been an incremental hit on all of the OEM's combined profits.They needed a strategy and some sc
Electronics Forum | Wed Jul 31 17:37:46 EDT 2002 | davef
We are not very smart about this. We base our machine PM on manufacturer�s recommendations. In real life, those recommendations are fairly conservative for a new a machine and probably need to be tailored for a more mature machine. The buzzword
Electronics Forum | Fri Sep 20 20:03:55 EDT 2002 | mjabure
Well chip I ought to leave you guys hanging in the breeze on this one , but here goes. Steve, your assumption that the nozzle is calculated as part of the component body for types 11 & 12 is incorrect. during center test on the 643's one of the par
Electronics Forum | Wed Sep 18 14:58:59 EDT 2002 | Claude_Couture
Just to add my 2 cents on the adjustment of pitch on MPA feeders: True: Panasonic do not make it easy to change the pitch on MPA feeders, the thickness of a metal part is what sets the pitch. My solution: for example, I get a 24mm X 12mm pitch MPA
Electronics Forum | Tue Sep 24 11:10:07 EDT 2002 | Gregg Temkin
I�d appreciate assistance in trying to resolve a placement/soldering problem. My company has designed a board which uses a large number of 0402 LED�s that are .028� high. The LED�s need to be soldered so that they point straight up and are not til
Electronics Forum | Wed Oct 30 01:23:22 EST 2002 | jasper
It has been my experience that when all > conditions are as they are supposed to be there > should be zero or very little deflection. When > you start placing components with pick and place > equipment that does not have a Z pressure sense, > yo
Electronics Forum | Mon Nov 11 11:42:26 EST 2002 | MikeF
Like Mark, I'm guessing your problem is with SMT parts on the top side, the solder is re-melting and some of the parts are moving around during when the board is being wave soldered. When I had some training on thru hole wave soldering way back when
Electronics Forum | Thu Feb 27 11:46:47 EST 2003 | genny
We have struggled with this as well. Basically, we have a consistent rotation for all packages of the same type, but I don't think our rotation has anything to do with the actual rotation that the PnP equipment actually wants to see. I believe our
.jpg)
Buyer, Seller, Broker of Electronic Assembly Equipment
Equipment Dealer / Broker / Auctions
309 West Pickle Alley
Rushford, MN USA
Phone: 507-864-7477
.gif)
