Electronics Forum | Tue Sep 08 10:19:27 EDT 2009 | grics
Good Morning! I need some clarification. Our company is working with a start up company on some prototypes. On the bottom of the assembly they are placing a SOT23-5 component. It is being presented to the wave so the lead banks are parallel to the
Electronics Forum | Thu Sep 17 04:48:51 EDT 2009 | grahamcooper22
The colour you see on the pads is tin/copper intermetallic layer. In your reflow the immersion tin coating and the copper pad underneath react to form in intermetalic layer. The effect is worse the hotter the pcb or area of the pcb gets. In IR reflow
Electronics Forum | Fri Sep 18 09:18:06 EDT 2009 | ysutariya
Also, it wouldn't hurt to perform SERA testing to determine the amount of free tin to begin with. From what I remember, I think you need 30 microinches of free tin to ensure success. XRF won't give you an accurate thickness reading as it counts the
Electronics Forum | Thu Sep 17 11:19:57 EDT 2009 | jdumont
Does anyone have a reference to a spec for this? We have a tall SMT IC that we coat with AR coating in a Asymtek spray coating machine. We do not have the angle head option to spray from a 45 so the sides of tall parts are sometimes left uncovered.
Electronics Forum | Fri Sep 18 12:21:03 EDT 2009 | kennyg
Does anyone have any off-the-shelf tool for measuring air gaps under components? Specifically to measure if a part is raised beyond special specifications, such as determining if a leaded connector is raised beyond 5, 10 or 20 mils from the PCB surf
Electronics Forum | Fri Sep 25 16:47:57 EDT 2009 | esoderberg
0.5mm pitch QFP's are typically mixed with large components on all of my boards. I usually use a 6 mil stencil with a minimum aperture width of 10 mils. Normal aperture size is 10 x 50 which causes shorts about 20% of the time. A recent purchase of
Electronics Forum | Fri Oct 09 02:54:57 EDT 2009 | omid_juve
Dear sir`s i want to place one TBGA144 with DRS24 rework station i use many different profile but with near all of them in the ramp stage and reflow stage the balls of the BGA thrown away from the part and cause many short circuit under it and also m
Electronics Forum | Mon Oct 19 12:17:16 EDT 2009 | wrongway
We have yet had the need to use local fids on our boards you must be putting down pretty fine pitch parts that are needing the acurcey if it is failing fids that are within the search area then maybe its somthing else size our lighting it should fin
Electronics Forum | Mon Oct 26 06:27:50 EDT 2009 | bandjwet
SMTnetters: Does anyone have experience in the average programming time that they use for calculating costs on using a solder dispense and place process for QFN rework? How about average cycle time from start to finish for same? We are comparing it
Electronics Forum | Fri Oct 30 07:16:17 EDT 2009 | jeffreyj
Any comments on a newer Essemtec CSM 7000 or 7100? How about an older Multitroniks Intelliplacer 10 ('00 or '01 vintage)? The latter seems a bit excessive for our purposes, and the fact they are now under Tyco's umbrella is definitely bad news, bu
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