Electronics Forum | Thu Sep 09 09:46:48 EDT 1999 | John Thorup
| | Hello everyone, | | Anybody know how to prevent EOS problem? | | Recently, we sent some defective IC components to original suppliers for further analysis, but the result is those parts were all damaged by EOS! | | Please somebody help us to pre
Electronics Forum | Fri Sep 10 13:44:29 EDT 1999 | Gyver
| | | Hello everyone, | | | Anybody know how to prevent EOS problem? | | | Recently, we sent some defective IC components to original suppliers for further analysis, but the result is those parts were all damaged by EOS! | | | Please somebody help u
Electronics Forum | Tue Sep 07 08:04:59 EDT 1999 | JC Leigh
| | Dear all, | | | | I don't know if I'm asking at the right place here, since you all seem to be more focused on process problems then programming problems (or perhaps programming isn't a problem for you). | | | | I'm using FUJI CP642's and I've
Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
Electronics Forum | Tue Aug 24 11:36:37 EDT 1999 | Jimmy G
| | | | Hello everyone, | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advanc
Electronics Forum | Mon Jul 26 11:20:40 EDT 1999 | Kevin Hussey
| | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) |
Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones
| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e
Electronics Forum | Mon Jun 28 21:07:00 EDT 1999 | Deon Nungaray
| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar
Electronics Forum | Mon Jun 07 13:51:48 EDT 1999 | Dave F
| | We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | | | | | | | John: Never heard of an "SOAC." SO packages are 50
Electronics Forum | Mon Jun 07 20:12:42 EDT 1999 | John Martell
Thanks for the advice, I'll check out that site. | | | We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | | | | | | | |
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