Electronics Forum: pass (Page 101 of 142)

Trouble selective soldering fine pitch connectors

Electronics Forum | Thu Dec 06 12:37:14 EST 2012 | deanm

We are having difficulty with bridging on a 2x50 pin 0.050" fine pitch connector using our selective soldering machine. It usually bridges at the end of the row, but sometimes it bridges all the pins together as it drags across (solid bridging). I

Re: Fair enough

Electronics Forum | Wed Dec 30 03:23:46 EST 1998 | Bob Willis

I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. Is there any one who has been running this process in production ?

Re: Fair enough

Electronics Forum | Wed Dec 30 09:09:42 EST 1998 | Earl Moon

I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. Is there any one who has been running this process in production

Re: Solder Mask IPC Standard

Electronics Forum | Sun Oct 10 18:53:04 EDT 1999 | Dreamsniper

Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. PCB is FR4 Solder Mask is LPI Reflow and W/S Profile =

Re: Strange problem with my dispenser

Electronics Forum | Wed Aug 11 10:21:03 EDT 1999 | Brian

Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation

Re: Strange problem with my dispenser

Electronics Forum | Wed Aug 11 11:54:50 EDT 1999 | Dave F

Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulati

Re: testing after SMt assembly

Electronics Forum | Fri Jul 23 10:16:16 EDT 1999 | Boca

Dear all Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. Our appliocation is Mainly fabrication of mother boards. Thanks In theory, ICT is the classical answer (In-Ci

Re: Fond Farwell II (Why I hate aggresive sales and marketing)

Electronics Forum | Sun Apr 18 01:58:23 EDT 1999 | Steve Gregory

Just to further explain myself a bit, and why I hate being bombarded by advertisements, is because I think others (sales and marketing people) are trying to manipulate me. Why do I think that? Say if you have 5 pick and place salesmen, 1 from Fuj

Re: Solder FINES vs. Solder Balls

Electronics Forum | Wed Apr 14 17:39:20 EDT 1999 | Dave F

Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? I consider "fines" individual unmelted metal spheres that are found in s

Re: Suspect BGAs

Electronics Forum | Tue Mar 16 18:27:34 EST 1999 | Earl Moon

We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of it


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