Electronics Forum | Fri Sep 11 17:23:00 EDT 1998 | Eric Miller
Hey Dave, sounds like your material is delaminating at a rapid rate, I would not recommend using them through your process, delaminating material has to go some where! When composite material is made, layers of fibre glass and epoxy resin are placed
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
Electronics Forum | Wed Aug 12 00:01:56 EDT 1998 | Peter
I have a customer who is transitioning from 100% thru hole boards to designing boards with smt components. We gave them our basic DFM guidelines and they have laid out 2 boards following these guidelines. When I saw the result of their first pass, I
Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Tue Jul 28 16:13:45 EDT 1998 | Steve Gregory
| Hello everybody. | Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at
Electronics Forum | Thu Jun 25 08:30:38 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Wed Jun 24 14:08:34 EDT 1998 | Henry Lee
I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will solder
Electronics Forum | Thu Jun 25 08:30:39 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
