Electronics Forum | Mon Nov 12 11:40:50 EST 2001 | caldon
Your broad question will bring many answers.You do not mention PCB type which plays a key part in the inspection specs you look for. Your question is like asking "What is the best automobile?" You will have 1,000,000 answers. Best answered this way:
Electronics Forum | Mon Dec 31 08:51:58 EST 2001 | davef
Warp depends on: * How close the board gets to its Tg during the solder cycle (the closer you get to the Tg the worse the warp gets) * Amount of copper on each side and the balance between the two * Thickness of the board * Overall length x width * T
Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin
Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom
Electronics Forum | Wed Mar 27 08:07:42 EST 2002 | caldon
Ovation Products (devision of Airline Hydraulics) makes a fixture just for Screen printing and PNP machines. This product is called grid lock. It's tooling that is air actuated and conforms to the bottom side of your PCB with gentle (gentle enough no
Electronics Forum | Sun Apr 28 07:34:34 EDT 2002 | hany_khoga
Dear Tom : I hope I �m not too late. We produce PC motherboards with some buses exceeding the speed of 100MHz . we use no clean flux and it is OK even with the residues you can see under a microscope. But according to our own experience through a mo
Electronics Forum | Fri May 10 01:41:04 EDT 2002 | ianchan
Steve, Hi mate, was doing some text book reading and saw this one paragraph that commented on the PCB fab plating could have residue chemistry inherent in the PCB if the fab process control isn't up to mark. such chemistry could surface to the Au/N
Electronics Forum | Fri May 17 03:04:15 EDT 2002 | Mike Konrad
This conversation reminds me of the old �How Many Engineers Does It Take To�� joke. We manufacturer the ionic contamination (ROSE, SEC) testers and I am not aware of anyone that performs such exacting surface area calculations. Most people use th
Electronics Forum | Thu Aug 08 17:51:51 EDT 2002 | davef
'The emailer on Cold Fusion came that way and we have been soooo busy trying to make sure the Geary's is gone before the date code comes-up that we just haven't had time for munitia like that.' Well, I'd like to revisit that decision, given: * Volum
Electronics Forum | Tue Sep 03 17:48:34 EDT 2002 | dphilbrick
My customer is finding a blue haze on some SMT pads after processing, kind of looks like a water spot on the surface of solder joints. It requires 20x mag and very good lighting to see. We have done 2 different ionic tests and the boards pass to clas
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
