Electronics Forum | Wed Apr 25 15:50:06 EDT 2007 | Upper Management
Dear Ms. Chunks, Your valuable input has been noted. Unfortunately, your approach won't work in this case. Our customers would like for us to have AOI. To be perfectly honest with you, if we could just rig up some camera-looking thing that move
Electronics Forum | Wed Apr 25 15:54:59 EDT 2007 | Upper Management
Dear Ms. Chunks, Your valuable input has been noted. Unfortunately, your approach won't work in this case. Our customers would like for us to have AOI. To be perfectly honest with you, if we could just rig up some camera-looking thing that move
Electronics Forum | Thu Apr 26 11:21:26 EDT 2007 | slthomas
Question...when the machine said something was wrong, was it reading something wrong (false failure), or was there a true descrepancy but not one that resulted in a bad connection (bridge or insufficient)? Also, did you perform a DOE on the process
Electronics Forum | Mon May 07 11:08:13 EDT 2007 | gregoryyork
Are the pallets hot and killing the foam head as they pass over or is the air pressure on the air knife toi high travelling back along the board killing the foam. If these are OK make sure you have sufficient back flow onthe wave and you are draining
Electronics Forum | Tue May 22 10:05:10 EDT 2007 | aj
Hi All, I acquired an AMP Semi-Automatic Press for backplane connectors and the like a while back , unfortunately without the Manual. Its part # is G776272. ( pneumatic). Does anyone out there know where I can get one ? I will try and contact th
Electronics Forum | Thu Jul 05 13:47:10 EDT 2007 | arun2382
QFN assembled on a PCB indicates paramteric fails when tested. When the QFN on PCB is reflowed a second time, it recovers and passes testing. Visual, X-ray inspection revealed no anomalies. Cross-section images of solder joint revealed no anomalies (
Electronics Forum | Thu Jul 05 15:13:46 EDT 2007 | joeherz
We've seen non-functional QFNs cured by touching up the toe fillets. Especially with parts that are not plated on the edge/face where you get minimal/no wetting due to oxidation of bare copper. I'm not suggesting that you touch everything up but th
Electronics Forum | Tue Sep 11 11:40:17 EDT 2007 | shing
Please help to answer me the followings questions: 1. The optimum temperature for IC reapir (TSOP & BGA), since many IC found defective after reapir by hot air gun 2. How many time does a IC(TSOP & BGA) can pass throught the IR Reflow without defecti
Electronics Forum | Mon Oct 08 09:48:22 EDT 2007 | slthomas
I used to just follow up profile development with a single pass with a MOLE, one thermocouple in air. I'd keep that profile as a baseline, and have the operators run the MOLE through prior to production and compare the results to the baseline. I foun
Electronics Forum | Sun Nov 04 01:04:04 EST 2007 | omidjuve
we are manufacturing some rf boards that works on a high frequency margins now our boards doesn't pass in impedance test and we concluded that the problem might cause by the solder paste that we are using . our solder alloy is sn62/pb36/ag2 and we t