Electronics Forum | Wed Jan 12 12:11:51 EST 2005 | Grant
Hi, Are you coating the bottom of the palette with flux? What's the material of the palette. I have not seen that, but we did have some weird problems when we did not add flux on a virgin palette, but once it dirtied up a little it was ok. We had
Electronics Forum | Tue Feb 15 06:53:50 EST 2005 | cyber_wolf
It seems that every time we do maintenance on our CP6 windmills, we have a lot of problems with nozzles sticking up inside the holders. It seems to happen for a while, then it goes away after we run for a bit. We follow the Fuji maintenance procedure
Electronics Forum | Wed Feb 23 14:17:21 EST 2005 | scombs
We also have 4796's and 4791's and have had the same issues with 0402 parts.. All the suggestions listed in the last post will help quite a bit. We found our biggest problem was the board supports due to the operators using the wrong type of pins ,
Electronics Forum | Wed Feb 23 17:31:33 EST 2005 | Brent Robinson
Nozzle size is probably the main issue, but it could be a problem with the vacuum level too. Vacuum level should be a minimun of 20 in HG. Also verify that you have 85 PSI going into the machine. A lot of times, the paste in the nozzle is due to t
Electronics Forum | Sat Mar 05 22:44:44 EST 2005 | gpaelmo
You can also try the Florida Circtech website or call them direct. There is a min. thickness requirement and if the board house does not follow it you will end up with scrap boards after the second pass (from experience). I even sent blank boards to
Electronics Forum | Thu Mar 10 15:10:07 EST 2005 | bandjwet
In reviewing the myriad of BGA reliability tech papers there seems to be little commonality in the type of test protocols. There are tests that are industry specific, device vendor specific and customer specific. What guidance in terms of minimum me
Electronics Forum | Thu Mar 17 10:24:43 EST 2005 | Bob R.
I can't answer your question directly, but we're an automotive supplier and we don't do dual reflow with QFPs because of their moisture sensitivity level. We don't have the processes in place to manage the time between first and second pass so we'd
Electronics Forum | Wed Mar 30 15:29:37 EST 2005 | Mark
I am not an expert however, I don't see any issues with this. Those joints of nearby components will melt and solidify back once they go below 183 C. Don't see how this could present quality issues as components may pass through reflow several time
Electronics Forum | Sat Apr 09 13:42:03 EDT 2005 | jh0n!
how funny... we just bought a up1500, no manuals/install cd, and we need to do the same thing. i was hoping that by removing /sigpro/user.pwl and /sigpro/permis.lst, and all references to them in sigpro.ini and sig1500.ini it'd let me in, but no luc
Electronics Forum | Tue Apr 12 12:08:06 EDT 2005 | Dave G
I use the solder sample pcb that comes w/ each batch of boards. We ask our pcb vendor to send 1 pcb for solder testing w/ each batch. This is usually a pcb that is completely done it just didn't pass electrical test @ the final stage. I kill two bird
