Electronics Forum: passives (Page 1 of 38)

Solder balling under passives

Electronics Forum | Mon Sep 19 09:31:28 EDT 2016 | emeto

Whatever the cause is, will be fixed by applying less paste. So Homeplate it is.

Solder balling under passives

Electronics Forum | Mon Sep 19 21:35:54 EDT 2016 | shriram

Appreciate your suggestion. NSMD pads are used for this design, the anomalies we found are 1. the trace running between pads has a lesser solder mask height compared the other area of the pads. 2. the NSMD pads doesnot have a trench close to pad e

Solder balling under passives

Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram

Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo

Solder balling under passives

Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch

Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC

Underfill encapsulating passives - Need test

Electronics Forum | Tue Aug 26 17:50:52 EDT 2014 | dkrawchuk

Hi, We have some boards that we apply an underfill to a BGA. Some boards have underfill that covered the surrounding passives. The customer is concerned that the different expansion rates will damage the passives. Does anyone know of a company th

Re: Adhesion loss on passives over wave

Electronics Forum | Fri Mar 19 13:26:19 EST 1999 | Scott Cook

Hi folks, I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet

Adhesion loss on passives over wave

Electronics Forum | Wed Mar 17 19:58:00 EST 1999 | Marc Ruggiero

Hi folks, I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and sometimes f

Re: Adhesion loss on passives over wave

Electronics Forum | Thu Mar 18 13:54:30 EST 1999 | John

Hi folks, I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet

Re: Adhesion loss on passives over wave

Electronics Forum | Thu Mar 18 17:18:22 EST 1999 | Earl Moon

Hi folks, I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and

Re: Adhesion loss on passives over wave

Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi

Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side

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