Electronics Forum | Thu Oct 16 08:41:21 EDT 2008 | davef
We don't associate solder balls with no-clean flux and humidity. For solder balls with no-clean flux, we'd rather have you thinking about: * Paste selection * Aperature size * Paste print process * Reflow recipe
Electronics Forum | Wed Oct 15 15:52:37 EDT 2008 | robinj
I'm looking into buying an offline solder paste height measurement system. Which are the best systems out there? As far as getting a better image for consistent height measurement what are the different technologies out there. Thanks in advance for a
Electronics Forum | Tue Oct 21 11:19:30 EDT 2008 | ljohnson
Sounds to me like your printer not releasing paste now and again. How can you be sure that you are not getting print skips. Are you using any kind on AOI?
Electronics Forum | Wed Dec 17 13:25:38 EST 2008 | evtimov
I am printing on DEKs and using simulara paramateres as for a solder it works really fine. In general going faster gives you more paste/glue. Less pressure gives you more paste/glue again. All the rest depends on your current board. Regards, Emil
Electronics Forum | Wed Dec 24 20:29:45 EST 2008 | xianhua_tang
Oh,I consider the process is wrong,it is stencil print paste-mount-reflow -apply glue-reflow,then wave solder. it must pass twice reflow,also the first reflow profile is different and the second .
Electronics Forum | Tue Jan 06 18:06:05 EST 2009 | aj
Hi all, I am currently trialling a solder paste which contains Bismuth. It is leadfree and reflows at 138 degrees C. I would appreciate any pros/cons? aj...
Electronics Forum | Mon Jan 12 04:28:05 EST 2009 | sachu_70
What is your alloy composition? Although your solder paste may have lower melting point, what about the alloy / metal used for plating solder lands on PCB and component termination? In most cases, there is no reliable joint as such solder may not com
Electronics Forum | Sat Jan 17 17:42:07 EST 2009 | viresh
what is the impact if a solder paste is used after 24 hours after tawing time
Electronics Forum | Sun Jan 18 09:20:26 EST 2009 | davef
We're not sure of the condition of your solder paste. So, afte 24 hours, if it's: * Unused, in a reclosed container, maybe a week of life depending on the environment * Used, scrap A simple coalescence test can quickly determine the condition of sol
Electronics Forum | Mon Mar 02 11:27:51 EST 2009 | wrongway
Check stencil is their a lot of paste still on the stencil if so that is the extra thickness maybe add more pressure. check to see if board is coming up far enough to touch the bottom of the stencil.
