Electronics Forum | Mon Dec 04 14:27:18 EST 2006 | pjc
Solder preforms can be used in SMT assembly for through-hole pin-in-paste process. In this process and modified aperture is used to print the paste with standard stencil printing, then a solder preform is picked and placed by a machine into the solde
Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev
Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas
Electronics Forum | Sun Dec 17 08:41:38 EST 2006 | davef
Paul We've seen "cold welding" of solder paste when dispensed improperly. It occurs in the narrow confinds of the nozzle when someone tries to pipe too much paste, too quickly. The friction of all those little solder balls and paste juice fighting
Electronics Forum | Mon Jan 29 09:50:37 EST 2007 | rgduval
I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free
Electronics Forum | Sun Feb 11 23:18:44 EST 2007 | M.Haris
1. If I go to the Pb-free solder paste, is it necessary that I have to change my reflow oven OR just by changing with respect to solder paste specification, I can reach my goal? 2. What is the �Low- Temperature Phase� in any solder paste alloy? 3.W
Electronics Forum | Tue Feb 13 16:28:17 EST 2007 | rob_thomas
There are solder pastes that seem to give you less voiding. Currently we are using Kester ,water soluble paste that gives us pretty good results on BGA's up to 0.5mm pitch. Stencil design was a challenge but we are getting consistent results . Here
Electronics Forum | Mon Apr 02 09:16:08 EDT 2007 | ed_faranda
Was wondering if anyone had any experience with Pin Though Paste with a no-lead process? I realize that some basic requirements will need to be met (i.e. Connector to with stand higher temperature, proper lead coating, ability to image, etc.). But,
Electronics Forum | Tue Apr 03 03:31:51 EDT 2007 | chrissieneale
Apparently because the machines are old and prone to break down they do all the printing for the day (maybe 6/7 different board types) up front. This doesn't make any sense to me - if the machine is going to break down, the machine is going to brea
Electronics Forum | Sat Apr 07 01:15:45 EDT 2007 | Haris
Hi I dont think there is a stencil problem or a printing one but i think you should check you paste specification regarding 20 mil pitch i.e. its ball size in microns so that you know Is that paste can be use for this type of components or not. Secon
Electronics Forum | Fri Apr 13 12:24:07 EDT 2007 | teamcanada
We assemble for a customer that is having an inconsistent low level analog interference we believe with the no clean flux residue from Alphas OM5100 solder paste. We are considering testing Amtechs 4300 water washable no clean paste. We will test bot
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