Electronics Forum | Thu Jun 06 11:42:24 EDT 2002 | Brad Jakeway
What you are seeing on your gold fingers is referred to as flux spattering. This is a very commond problem with gold fingers if you have a zero flux spattering criteria for quality control. The key to eliminating this problem is in the reflow profi
Electronics Forum | Wed Jun 05 17:14:40 EDT 2002 | davef
First, I suggest that people search the SMTnet Archives in just about every response that I make. Second, you need to work on your DOE jargon * Factors. Independent or input variables * Effects. Results. Dependent or output variables. Third, the
Electronics Forum | Thu Jun 06 14:20:14 EDT 2002 | davef
For solder paste print inspection critera, look here: http://www.ppm-monitoring.com/
Electronics Forum | Thu Jun 06 09:45:14 EDT 2002 | Hussman69
We based ours on the type of paste we use (stencil life) and not so much the machine. Then we coupled that to what 'true' conditions we normally see in our plant, and determined that under these conditions Max & min) our printing process should be g
Electronics Forum | Thu Jun 06 21:35:22 EDT 2002 | ianchan
Hi mates, 1) Firstly, thanks for everyone's reply to this thread. Cheers! 2) Secondly, Hussman69: sure u dun mean that blokes' tie was too tight? musta cut off his blood flow and oxygen?!? 3) Thirdly, we checked with our paste supplier, and they r
Electronics Forum | Wed Jul 24 11:42:44 EDT 2002 | blnorman
Checked with them and they do make this paste, thanks.
Electronics Forum | Mon Aug 12 12:05:35 EDT 2002 | russ
I use Paste for high temp balls and/or co-planarity/warpage issues. normally I only use paste flux for ball attachment. One down side to paste application is registration and volume anomalies with those little micro-stencils (for me anyway). Your
Electronics Forum | Fri Aug 30 06:18:55 EDT 2002 | seje
Thanks Jim, that should help. And yes, there is light at the end of the tunnel.... now : ) -Sasu-
Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton
We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac
Electronics Forum | Tue Sep 17 15:47:42 EDT 2002 | stepheno
Where I worked previously we had some boards with a couple 15 mil pitch parts. The first batch we got all had undersized pads. We had lots of bridging. We had less bridging with bigger pads. The ball size in the paste makes a bigger diffence regar
