Electronics Forum | Thu May 26 07:53:42 EDT 2022 | jojoled
Hi.Thanks for reply. 1. - I guess after JETting the paste, the head will go aside, to allow head with HD camera(SPI) to do the job.....and thus if used for AOI , the same camera will be much higher above components, not damaging anything....this is
Electronics Forum | Wed Feb 15 10:59:58 EST 2023 | wippsen
the viscosity of the paste is too high, printing parameter is not the problem. did you use old solder?
Electronics Forum | Mon Jul 17 16:55:19 EDT 2023 | cyber_wolf
Yes I have used it on multiple occasions. The purpose is to potentially help paste release from the stencil.
Electronics Forum | Fri Aug 11 00:51:41 EDT 2023 | ttheis
Have you tried asking your paste supplier about this issue?
Electronics Forum | Tue Sep 19 10:18:17 EDT 2023 | majdi4
Hello Luis , see the attached photo ( and it is applicable for stencils 100µm thick )
Electronics Forum | Sat Feb 24 09:07:03 EST 2024 | emanuel
Not very long, minutes
Electronics Forum | Thu Jun 29 09:29:46 EDT 2000 | JAX
sree, You might want to check the archives. If not, I found this just a few questions below yours!! [Back to thread listing at top] Posted by Igmar on June 22, 2000 at 10:27:26 AM EST Can someone please help with the aperture size on a Micro BGA st
Electronics Forum | Sat May 06 08:46:46 EDT 2000 | Dave F
Sal: Now you�re talkin�, buddy!!! Darrell is correct. All things being equal, thermal relieved vias (and through holes) should be the hottest spot on the board at reflow temperatures. Vias are gonna take on solder like drippin�s take to biscuits.
Electronics Forum | Fri Jul 06 12:07:07 EDT 2001 | nwyatt
I have been researching lead-free paste for a while now and I will share with you what I can. Firstly, SnAgCu seems to be the common industry choice. It really depends on your application - the cell phone/pda sector is primarly using different comb
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
