Electronics Forum | Thu Feb 06 13:18:43 EST 2003 | Vince Cook
Mr. Fuller, I came across your inquiry while doing some light lunchtime reading. I work for Universal in the group that creates nozzles/grippers. We evaluate applications involving a wide vareity of components, connectors, etc. I'm not a salesman
Electronics Forum | Mon Sep 14 10:25:40 EDT 1998 | Wayne Bracy
| Our company currently donesn't have any type of sonic wash to wash boards that have been "miss printed" Wanting to know the best way to go about this. So what we are having to do is spray down the boards with alcohol and wipeing the solder paste
Electronics Forum | Mon Aug 17 19:43:43 EDT 1998 | Bill Schreiber
Smart Sonic has a new Model 2003 Stencil Cleaner that is designed to clean SMD adhesives, solder paste and post solder flux residue from wave solder pallets, oven air amplifiers, etc. all in the same system at the same time with the same chemistry. C
Electronics Forum | Mon Aug 10 11:58:33 EDT 1998 | Wayne Bracy
| | I am trying to get an idea of what system seems to work best for solder paste inspection. I am looking for basic table top models with he capabilites of height and width measurements. Can anyone give me suggestions, pricing and why you prefer
Electronics Forum | Tue Jul 28 14:34:47 EDT 1998 | upinder singh
Hello everybody. Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at the
Electronics Forum | Tue Jul 21 09:53:13 EDT 1998 | Steve Brown
Here at M/A-Com we use lead free solder pastes for two purposes, environment and prevention of secondary reflow in subsequent processes. The UK engineering journals all report the trends towards lead free alloys, especially in the telecommunications
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Wed Jul 22 20:46:13 EDT 1998 | Dave F
| Is there anybody with knowledge in the process with PHT components (Components with terminals) - Cause with make board with top and bottom side, with SMD and Auto Insertion Technology. So we want to do a Entire Cell with both technology, and witho
Electronics Forum | Sat Aug 01 09:19:59 EDT 1998 | Claudio Carnevali
I can explain my experience. I had a no clean paste and in summer I had a lot of problems. Now I have installed and air cooling system and I work with 25�C and 50-55%. I think you'll have less problems but smt problems usually doesn't have only one a