Electronics Forum: past (Page 311 of 989)

Solder particals in the oven?

Electronics Forum | Thu Jun 06 12:24:30 EDT 2002 | cyber_wolf

Brad your theory sounds good, but I have seen this happen at very low ramp rates .5 deg to 1.5 deg C rate of rise a sec. with the same soak duration you mentioned. If flux spattering is the case and you are using Alpha paste..switch to Indium and yo

REFLOW SOLDERING OF THROUGH-HOLE COMPONENTS

Electronics Forum | Wed Jun 26 15:34:09 EDT 2002 | Daan Terstegge

It does work, but you must keep in mind that not only the stencil must be designed for it, but also the board. Trying to use the pin-in-paste process for a connector with an ordinary wave-solder layout will result in lots of touch-up. You'll need sma

Cleaning SMD Adhesives

Electronics Forum | Thu Jul 25 05:56:32 EDT 2002 | ericchua

Hello, Understand you have problem of cleaning adhesives from Dek Pump Print stencil. Well, we have a cleaning machine which able to clean solder paste and adhesives. And also, we are not using any chemical but use water-base detergent. We had few c

SMT Equipment

Electronics Forum | Mon Jul 29 08:21:54 EDT 2002 | pjc

All DEK 248 semi-auto printers have been built in China for quite some time (years). Its shipped to the UK from China. All DEK ELA models are now built in China (past 6 mos.?). Thats the fact Jack. All MPM models are built in Mass. Its the savings in

Glue & Paste Printing on Same side of the PCB

Electronics Forum | Wed Aug 07 05:08:04 EDT 2002 | matherat

This sounds like it could be a SIPAD solid solder application. Bring the boards in with the solderpaste already on them in a flattened solid form. Then you could print glue on them without disturbing wet paste. 1.Print glue. (Might take a little

Simultaneously Double side reflow

Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef

Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The

OSP / Paste Printing Problems

Electronics Forum | Thu Aug 29 20:15:26 EDT 2002 | davef

That you are getting BIG gobs of solder on the pads indicates that your print / paste process is probably OK. Sounds like someone did something bad to the OSP. Tell us about: * Supplier and brand of OSP that your board fabricator used. * Number of

OSP / Paste Printing Problems

Electronics Forum | Fri Aug 30 22:20:27 EDT 2002 | lysik

265 is a great unit. Your process should be OK. I am sorry I asked you to check it I just wanted to start with the basics. I am at a loss. May be a bad batch of paste. I am reaching for straws. I know it sounds crazy but try a really slow (snap off)

OSP / Paste Printing Problems

Electronics Forum | Tue Sep 03 00:03:00 EDT 2002 | TLe

Thanks Guys, I agree, you have to start with basics. Tri Jet, you have a point there: " art not not a science". Basically, it is a simple process. Maby that is why we "rocket scientists" try to get far-fetched answers to our process challenges, it

Solder and flux

Electronics Forum | Wed Nov 06 05:13:01 EST 2002 | Dreamsniper

Crystalline flux if it is really clear should not be a problem. We were using Amtech paste before and we have the same results. Sometimes we mistakenly see it as a dry joint because of the reflections from the lighting of our Metcal inspection system


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