Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz
Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried
Electronics Forum | Wed May 12 06:57:00 EDT 2004 | davef
You say you have lots of problems with a BGA, tell us about: * Specific problems you see. * Solder paste supplier�s recommended profile. * Temperatures measured on the problem ball[s] of the BGA during reflow. When you say �u1 BGA�, what do mean? W
Electronics Forum | Tue Jun 01 07:18:15 EDT 2004 | johnwnz
Abraham, it kinda depends on your BGA ball size, device height. The probem is that very few machines will manage to get cleanign fluid under a BGA and you certainly will struggle to get it dry. You would need to look at various supponofiers as well.
Electronics Forum | Mon Jun 07 17:43:42 EDT 2004 | russ
Doing a little poll here. How many of you are using lead free paste and what type/brand are you using. We are using Alpha OM338 SAC405. I am not liking it very much so far. It seems to be too viscous. It is definitely the thinnest stuff I have e
Electronics Forum | Thu Jun 24 23:00:36 EDT 2004 | yukim
Tried with several lots of solder paste, manufactured in Feb and March this year. Work ambient: 25C, 60~70%. Is this humidity too much? I'll reduce the ramp in our profile. One change: We changed the conveyor motor in our reflow oven just before the
Electronics Forum | Sat Jun 26 15:26:10 EDT 2004 | russ
I am very happy with Alpha Metals WS709 or even WS609. Almost all of our product is Immersion gold and we place down to 16mil pitch every day along with 0201 and uBGA. Immersion gold from my experience, solders extremely well with every paste I hav
Electronics Forum | Sun Jul 04 19:49:05 EDT 2004 | indy
Hello Everyone, We are having some problem with Palladium-Silver surface finish. We have ceramic components with the above surface finish. When we try to assemble these on Sn/Pb solder, we are observing open joints. If we reflow the compt for more t
Electronics Forum | Mon Jul 26 19:40:17 EDT 2004 | Grant
Hi, That's a good idea. I might head down the the 7-Eleven, and try it! I did not realize there is not too much to be gained by using refrigeration. We don't keep much paste in stock and buy it as we need it, so perhaps we should just keep it out r
Electronics Forum | Thu Jul 22 20:41:11 EDT 2004 | C.W
hi All, i have recently running a Ceramic board with silver/palladium surface finish, using Alpha Metal 63/37 WS solder paste, soldering meet IPC standard after reflow, however, the solder joint look grainy, not sure if there could be too much interm
Electronics Forum | Wed Jul 28 19:01:06 EDT 2004 | gregoryyork
very difficult to say that all no cleans must be cleaned for reliability. Cleaning in its own right causes many problems i.e leaving wax residues and activators from incorrectly cleaned no clean pastes, terrible to get off. Decent no clean liquid flu
