Electronics Forum | Tue Jun 02 08:19:50 EDT 1998 | Zanolli
Is anyone familiar with assembly procedures for the AMP� straddle mount Mictor connector? If so are there any suggestions to solve difficulty in slitting through the ground pin PTH barrels� and applying paste as reccommended?
Electronics Forum | Fri May 29 14:01:36 EDT 1998 | Joseph How
Does anyone out there can let me know how to clean a Entek Coating Board if I have a misprint during solder paste printing?
Electronics Forum | Fri May 29 13:37:18 EDT 1998 | Ryan Jennens
We are getting solder balls after reflow of surface mount components. We are using a no-clean paste and a new jar seemed to help for a little bit. Any ideas? Thanks in advance
Electronics Forum | Tue May 19 21:27:27 EDT 1998 | Phil Teerink
| We are seeking information on comparison between Cimbridge of Mitron and Unicam CIM system. Please help. I have not seen Cimbridge, but have been using UNICAM for the past year. give me a call if you'd like to discuss it's merits 604-291-2025
Electronics Forum | Wed Apr 29 14:30:49 EDT 1998 | Rob Williams
DEAR TECHNETTER'S, When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Thu Apr 30 14:22:21 EDT 1998 | ETS, LLC
| DEAR TECHNETTER'S, | When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Wed Apr 29 14:59:54 EDT 1998 | Earl Moon
| DEAR TECHNETTER'S, | When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Thu Apr 30 08:55:53 EDT 1998 | Earl Moon
| | DEAR TECHNETTER'S, | | When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Thu Apr 30 08:55:10 EDT 1998 | Chrys
| | DEAR TECHNETTER'S, | | When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Thu Apr 30 11:28:23 EDT 1998 | Earl Moon
| | | DEAR TECHNETTER'S, | | | When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
