Electronics Forum | Fri Apr 25 15:01:29 EDT 2003 | swagner
Go to http://www.gsilumonics.com we use several of their systems for both paste and component inspection and week in and week out maintain a 99.85%+ first pass yield on a no post reflow repair line.
Electronics Forum | Tue Apr 27 00:18:08 EDT 2004 | Garian
Since you have used malcom softener, did you encounter and sudden rise of void level in the solder joints as compared to manual stirring?
Electronics Forum | Thu Apr 17 10:25:42 EDT 2003 | davef
You'd think 219*C should be warm enough, but we'd go higher just to get the part to stick. What is: * LED terminations material? * Alloy and flux type of your solder paste? Is you solder sticking to the pad and not to the component? Or what?
Electronics Forum | Wed Apr 16 08:15:55 EDT 2003 | davef
Check with your temperature profile equipment supplier [eg, KIC, ECD, etc]. We use a download from ECD that lists most ovens and solder pastes that make it [or one like from another supplier] a good place to start.
Electronics Forum | Tue May 06 22:31:52 EDT 2003 | yukim
Yes, we did try: built a lot of 200 PCBs with Sn62Ag2 solder paste (we have been using Sn63) and it helped, but not eliminated the problem.
Electronics Forum | Fri May 30 11:23:10 EDT 2003 | dsuraski
AIM has an article that includes anti-tombstoning solder paste information. It's called "Reducing The Tombstoning of Small Discrete Components" and is located at http://www.aimsolder.com/technical_articles.cfm#14 Or I can send a copy to anyone inte
Electronics Forum | Wed May 21 14:16:40 EDT 2003 | caldon
Dyann- There are two companies I have used in the past. 1) ACI in Philadelphia - Guy Ramsey 610-362-1200; Gramsey@aciusa.org 2) Soldering Technology - Mel Parrish 256.461.9191; http://www.solderingtech.com Cal Communications Test Design, Inc www.CTD
Electronics Forum | Thu Jun 26 04:34:49 EDT 2003 | emeto
Hi James, I saw very good posts here.Now I will give you one more practical way: 1. My advice is to encrease the temperature(like your first sidgestion). Termostress is important thing so your first zone should be 120-150C. 2. The paste profile. If
Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Tue Jul 15 10:33:39 EDT 2003 | MA/NY DDave
Hi, What are you soldering with Pb50Sn50? YiEngr, MA/NY DDave