Electronics Forum | Thu Jan 22 09:21:45 EST 2004 | davef
Oh, another thing, we do not like to probe copper. It's hard, compared to solder, and beats-up the probes too much. [As Patrick Bruneel states in this thread.] Consider reflowing paste on your test pads.
Electronics Forum | Tue Feb 10 15:13:06 EST 2004 | patthemack
Hey Vinny, Sorry I haven't looked at this for a while. 3 things to try: Tombstoning- The ground plane side is larger because the solder mask allows for a little slop at the board shop (clearance around a pad of a few mils). Since there is not a defi
Electronics Forum | Tue Jan 27 10:57:23 EST 2004 | samaniegocesar
Hello Dave The information you sent me will be the base to start some samples, I'm doing some test with Heraeus and Indium solder paste.. I apreciate your support.. Best regards...
Electronics Forum | Mon Feb 02 13:14:11 EST 2004 | kauer
Hey, going to lunch now. Just for kicks, did you try to re-load Mint files? They may have been lost some other way, I have seen the DEK software do some crazy stuff in the past. Talk to You in a bit.
Electronics Forum | Wed Feb 04 16:54:04 EST 2004 | mk
Hopefully this is not a stupid questions but, if you are printing low tech surface mount boards, is it possible to print through a mesh screen versus a stencil? Isn't that the way it used to be done? Like soldermask only stainless steel versus polyes
Electronics Forum | Thu Feb 05 17:33:08 EST 2004 | black5629
Yep, did that for many years in the 80's and early 90's. I wonder if their are suppliers that still do the emuslions? Anyone?
Electronics Forum | Fri Feb 20 11:29:05 EST 2004 | teamcanada
Ive had a 4 zone reflow oven for the past 4 years. No problems or breakdowns. tech questions have been answered when asked
Electronics Forum | Mon Feb 16 05:45:45 EST 2004 | mk
Have you thought about ssd? Boards already have the paste on them when they come in. www.sipad.net
Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay
First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183
Electronics Forum | Fri Feb 20 15:07:31 EST 2004 | agp
I agree with Jay. The paste will reflow first before the balls. The main reason is the flux content and the dimension of the spheres.
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