Electronics Forum: past (Page 511 of 989)

Warming up solder paste at start of days production

Electronics Forum | Tue Jul 27 22:30:19 EDT 2004 | KEN

Sr. Tech, when you say you have never had a problem, what exactly does that mean? How do you know you have never had a problem directly associated with your solder process? Do you actively measure your defect levels? How do you maintain traceabili

Solid Solder Deposit

Electronics Forum | Mon Aug 09 15:49:16 EDT 2004 | celldude

We have definitely seen money saved. There is a lot less rework after reflow. Money is also saved in overtime. for example...when we are building a first article board with many placements, it is not always possible to get the first board through the

Crystalized Flux under BGA

Electronics Forum | Wed Aug 04 16:09:48 EDT 2004 | Dreamsniper

Hi, Thanks for your reply. I run 2 boards, using the same paste, thermal profile and the same method of aqueous cleaning, 1st is a Topline test board with topline BGA (BGA 272 with 1.27 Pitch) and the 2nd is our product PCB with our BGA from Motoro

BGA open joint

Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W

Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se

lead pull out issue

Electronics Forum | Tue Aug 24 21:52:06 EDT 2004 | rose

recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was reflowed u

lead pull out issue

Electronics Forum | Wed Aug 25 20:48:17 EDT 2004 | rose

Hello recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was refl

DEK vs EKRA

Electronics Forum | Fri Sep 24 12:20:58 EDT 2004 | Simon UK

Hi there, I have been using DEK's of all types over the past 9 years, with a few SMTech's and MPM's thrown in for good measure. I personally would recommend using DEK, they may seem expensive, but i find that worth the cost with the good support we

About use of water washable pastes and fluxes

Electronics Forum | Wed Jan 05 08:58:13 EST 2005 | davef

Q1. Is it enough to use only water while cleaning or is it necessary to use any additional chemistries and/or saponifiers as well? A1. It depends on: * Flux residues that you're cleaning * Standoff of the components * Cleaning technology [we've neve

Lead free profile

Electronics Forum | Sat Feb 05 23:54:37 EST 2005 | sms_don

Hello, I found the previous discussion of lead free profiles on 5 zone ovens very interesting. I had the same concerns, but have recently succeeded in creating profiles on a 5 Zone QUAD oven that have eliminated solder splatter or Solder on Gold w

Sudden paste release problem

Electronics Forum | Fri Feb 11 00:22:05 EST 2005 | Grant

Hi, That's what I am thinking, and we might have a dirty stencils and cannot see the problem. We are going to get a magnifier, and check it out. I did not think the stencil could bur, but I didn't want to shoot the guys down when they had an idea on


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