Electronics Forum: past (Page 526 of 989)

omit stencil apertures to hand solder or paste, reflow then solder.

Electronics Forum | Tue Feb 25 06:18:55 EST 2020 | spoiltforchoice

First question would be why are you hand soldering these resistors? I would expect ENIG to be perfectly solderable after reflow and quite some time later. If you leave the apertures out of the stencil and then decide to automate fitting them, you'l

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Wed Mar 18 11:27:24 EDT 2020 | slthomas

I am about to order a stencil and I can already see that I'm going to have issues. I'm hoping someone has a recipe for this scenario that we haven't tried yet. The parts are 16 mil pitch bga's, the pads are NSMD (10 mil dia. with 12.6 mil mask open

HIP defect in BGA

Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan

Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr

Solder mask vs non solder mask defined pads

Electronics Forum | Tue Feb 09 16:53:06 EST 2021 | SMTA-64387083

The size of the pad changes among the two. A solder mask defined pad will always be larger than a copper defined by your mask expansion setting. This will affect paste volume, if your standard paste aperture is designed for copper defined pads you m

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 23:23:00 EDT 2021 | llawrence

The QFP pitch is 0.5mm. Pad size is 1.475 x 0.3mm, and the new aperture size is 1.32 x 0.22mm. I'm not sure about whether or not it is lasered, but on the newly ordered stencil I selected the polishing option. Looks like the pad width is already 2/3

Panasonic CM Nozzle shifts LED's positions

Electronics Forum | Fri May 13 19:48:28 EDT 2022 | cbeneat

Not completely. We end up increasing the blow off/vacuum break air pressure. The only issue with that is if we go too high, and a small part is close to the light it will blow it out of position. So on occasion there is a balancing act we have to do.

SMTNET Email?

Electronics Forum | Fri Jun 24 13:59:15 EDT 2022 | davef

I received the same message for the 2nd, 3rd & 4th papers and have gotten SMTnet technical people working on correcting the issue Thanks for making us aware. [davefatsmtnet.com] Effect of Nano-Coated Stencil on 01005 Printing [https://smtnet.co

What method for cleaning a wiped board?

Electronics Forum | Thu May 04 01:52:17 EDT 2023 | davef

Look at IPC-7526 - Stencil and Misprinted Board Cleaning Handbook, Misprinted Circuit Board CleaningCLEANING [ https://www.multi-circuit-boards.eu/fileadmin/user_upload/downloads/leiterplatten_design-hilfe/ipc-7526.pdf ] ITW/EAE says "Typically, th

BGA Solder Short

Electronics Forum | Mon Aug 07 04:05:43 EDT 2023 | suradi

May I share regarding this issue. Initially, please define the root cause clearly, is it from materials or process. Refer to the picture, if the short location is not randomly meaning there is the process issue. It could be stencil design or paste pr

Stencils with two PCB layouts

Electronics Forum | Thu Feb 01 19:31:10 EST 2024 | SMTA-74685453

I am curious if there is any benefit to using two different PCB paste layouts on one stencil. If I have a small PCB with a layout that doesn't take up much space on the stencil, would it be worth it to have both the secondary and primary side apertur


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