Electronics Forum | Wed May 17 12:22:54 EDT 2000 | JAX
Ramot, Without further explanation everyone here is just taking stabs at it..... Sounds normal, I'm game! Have you looked at board finish(HASL?)?? Measured paste height?? Are they always off in the same direction? If not, Handling?? What are the sp
Electronics Forum | Sat May 06 06:52:31 EDT 2000 | Dane Stokes
Richard, On the large arpetures I have seen they have been divided into four smaller arpetures to cover the placement area to reduce the ammount of paste. Just tell them to divied the total area into quarters and decrease the size of the quarter pie
Electronics Forum | Wed May 03 20:19:31 EDT 2000 | Dave F
Sal: Sorry, sometimes (more often than I�d like to admit) I�m a bit dense. But first � Leaching. Dissolution of a metal coating into liquid solder. Leaching applies to liquid solder and is applied inaccurately to metallurgical effects, like diff
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Fri Apr 21 12:43:51 EDT 2000 | David
We are going to hand place through hole connectors by screening them top side in a double sided reflow board. I saw this done before sucessfully on a daily basis but is there anyone with a paper or specs as to what aperture size, any special pad cons
Electronics Forum | Wed Apr 12 22:26:08 EDT 2000 | Alberto Hern�ndez
Hi Kevin!!! I have worked with both sides boards in 3 differents ways: a)Glue-Solder paste- Manual assembly- Wave soldering For the bottom side we placed glue dot in the board then we placed parts and finally the convection reflow at 150�C each zone
Electronics Forum | Wed Apr 12 11:00:26 EDT 2000 | NickMata
Aside from all of what you've done I would also suggest you take a look at component specs. Some vendors recommend a certain paste composition, for example a 2% silver content. I have found out thru experience that when using these components my to
Electronics Forum | Fri Apr 07 16:04:34 EDT 2000 | John
Anyone out there using solder paste (dispense) on through hole technology parts? I would like to know how it's working out for you. Which method or technique are you using? Have you ever tried to dispense on the component side and place through the d
Electronics Forum | Fri Mar 24 16:10:04 EST 2000 | John
I have used either a Dremmel tool or a Pace rework station on the past to do the trace cutting. You basically grind through the mask and the trace with the edge of a very thin cutter, stopping once all teh copper is gone. You may want to cover the cu
Electronics Forum | Mon Mar 20 10:54:36 EST 2000 | Glenn Robertson
Jack - The last time I checked IBM was specifying a minimum of 4800 cubic mils of paste for each pad. This is required for acceptable reliability, not just to make the connection. There is no way you are getting that volume with a 5 mil stencil
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