Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69
Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending
Electronics Forum | Mon Aug 26 20:33:50 EDT 2002 | davef
Not as such. Generally, people tailor their profiles to produce glam solder connections on their boards. Search the fine SMTnet Archives for discussion on the factors affecting solder reflow recipes. What is the best way to get these PCB made to s
Electronics Forum | Fri Sep 06 11:58:21 EDT 2002 | Brian W.
The most effective method is to monitor both printing results and parameters. Periodically (maybe once per month), run QCCalc or another program to measure the machine's capability to hold its set parameters. I also run control charts on the paste h
Electronics Forum | Wed Nov 20 03:52:16 EST 2002 | iman
Hello, need help on intrusive reflow process, thanks in advance to the experts and general info sharing :) need some help to obtain answers, to following questions: 1) PCB is FR4, 1.6mm thick, 4 layers, what stencil thickness (stencil design guide
Electronics Forum | Thu Nov 21 05:44:07 EST 2002 | kcorrin
We produce several boards with reflowed components on top and bottom. We are finding the solder has wetted to the leads but did not flow completely to the end of the lands. Several factors/causes?: 1) Board warping but paste deposits look good. 2) Mo
Electronics Forum | Tue Dec 17 20:25:13 EST 2002 | iman
Check : 1) design aspect ratio / are ratio required to fabricate the stencil you r using. 2) check if the stencil maker is using your checked aspect ratio / area ratio? if not the same, what are they using? any QA report confirming actual dimension
Electronics Forum | Tue Apr 15 08:38:23 EDT 2003 | pjc
Don't have any specific links to papers and articles. Try searching on the IPC.org (plus APEX show http://www.goapex.org) and SMTA.org web sites. Any papers and articles on the process from equipment mfg.'s should be taken with a grain of salt. Sold
Electronics Forum | Tue Jan 13 16:01:06 EST 2004 | russ
I believe that solder paste will need to be applied to this part. I have re-balled these in the past in a low volume situation and here is what I did and there appears to be no adverse effects to the component. Get a stencil (I use 8 mil for .032"
Electronics Forum | Thu Apr 01 13:16:56 EST 2004 | Jimmy
>When these boards are built new do we not have solder >>paste on the ground pad and then reflow? Has this caused >>any misregistration for you? We didnt assemble these boards so I have no knowledge of the manufacturing process that was implemented h
Electronics Forum | Tue Apr 13 22:48:11 EDT 2004 | Ken
I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviously not the case. It looks like you balls are almost pure tin (mp=238C) You are correct. This is exactly the same as using 10/90 high temp balls o