Electronics Forum | Mon Jun 19 08:49:40 EDT 2017 | westshoredesign
Just buy a separate machine to apply paste. You'll be able to run faster, (by doing more at the same time) and you can probably find an air-over-syringe system for less than $2000USD. At the end of the day, that's probably less than you'll spend in t
Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Thu Jul 25 12:25:54 EDT 2019 | davef
In “J-STD-001 Rev G Amendment 1 Process Qualification” Debbie Carboni, Global Product Line Manager, KYZEN Corp, Nashville, TN said: What change constitutes a need for requalification? Major/ Level 1 – Flux or flux-bearing materials (e.g. flux, so
Electronics Forum | Tue Oct 08 05:41:17 EDT 2019 | spoiltforchoice
I batch print boards, we're talking maybe 1/2 days worth at a time into a magazine. Its not a unique approach, especially if you don't run a fully inline process. However to do that you need a paste that has a decent tolerance of being treated that w
Electronics Forum | Tue Nov 19 21:38:39 EST 2019 | zack
Hello, The first thing that you need to do is to make process mapping about this incident, so you can exactly determine all factors and observable changes happened during 2 weeks of timeline difference. According to my experience, if all equipment
Electronics Forum | Thu Dec 26 17:13:43 EST 2019 | rgduval
Doesn't really look like no-clean to me...typically, no-clean encapsulates the solder joint after reflow, trapping any organics. This looks like plain-old water soluble flux, that cooked a bit too much in reflow. As you noted, it cleaned up with
Electronics Forum | Thu Apr 29 10:24:15 EDT 2021 | oxygensmd
I have the same issue but with one customer only. All the other have smaller or more difficult QFPs with really low bridging issues - close to no-one. I think the PCB and PCB design also an issue - other customers are using 32/64/100/144 QFPs and we
Electronics Forum | Fri Jun 04 11:54:22 EDT 2021 | cbart
We do this quote often with our older Summit machine. there are a few ways to do this. all of these are assuming you have parts on the boards already and are working around them. 1- if you have a good tech that can add solder to the pads on the PCB a
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Mon Nov 29 11:37:51 EST 1999 | cpitarys
Hello Jason, I will look for the best price and service support to start. Also request an in house trial at the vendor. Jason, are you looking to remove a no clean paste or water soluble paste? Single Chamber Equipment: Most stencil cleaners opera
