Electronics Forum | Wed Oct 23 14:45:00 EDT 2002 | Tom G
I haven't tried anything like that but had some experience with .8 mm pitch SSOPs. Immersion depth in wave was very critical- had to control Lambda pump speeds within 20 RPM and even then it would change as solder level dropped. Need thieving pads o
Electronics Forum | Thu Oct 03 15:14:46 EDT 2002 | SMTGuy
Good Day Everyone, Can anyone offer any advice on 0201 aperture design? We are looking at an application that will require them. We would like to do some experimentation first. Also, assuming an OA flux, would we need a type 4 or 5 powder paste to p
Electronics Forum | Thu Oct 17 21:32:28 EDT 2002 | davef
Please help to clairify the problem. Are we talking: * A pre-reflow [placement] problem? * A post-reflow [solder wetting] problem? Is the wetting issue that you mention related to the board or to the component? Please give us a little more detail
Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI
Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject
Electronics Forum | Mon Nov 04 14:05:51 EST 2002 | cnoonan
This is what pisses me off in this industry today. It seems the operators are in charge of the whole process. Management and supervisors are too afraid of lawsuits to lay down the rules and enforce them. If your procedure states and I am sure ever
Electronics Forum | Wed Nov 06 18:27:18 EST 2002 | MikeF
At this time we will be hand spraying acrylic, probably using spray cans until we decide on a spray gun or an air brush, and get one ordered. Our volume is too low to even consider an automated system. Our current requirement is on an item designed
Electronics Forum | Thu Nov 07 07:53:27 EST 2002 | cyber_wolf
Dr. Ning Cheng Lee from Indium Corp. of America has written papers on this phenomenon.Perhaps they would be willing to assist you. I am pretty sure I know exactly what you are talking about. We see this as well.Does it kinda resemble a disturbed sol
Electronics Forum | Fri Nov 08 18:36:31 EST 2002 | leeloo
Nowadays I have a problem, I am in chsrge of the section of smt in my company, have a normal process inside my department with a minimal level of mistakes, the problem happens when the material is liberated to the lines of production on happened for
Electronics Forum | Mon Nov 25 22:08:05 EST 2002 | Ben
Thanks for the advise. I got the advise from my solder paste vendor to increase the time above melting point for flux outglassing to escape. I tried but no big help. For the moisture issue, actually I've try to bake both the PCB and components at 12
Electronics Forum | Sat Nov 23 10:19:39 EST 2002 | davef
This sounds alot like the warping that we all see periodically in BGA. CTE of material is temperature dependent and not temperature changing rate dependent, so you are pretty much hosed by the physics. Regardless, I do like trying like crazy to g
