Electronics Forum | Sat Aug 06 15:23:51 EDT 2005 | Thaqalain Mahdi
I get to know from past 6 months of looking home electronics,that most of them failed b/c of solder fault. I never done soldering by hand,although done SMT Inspection jobs,now I know importance of soldering quality in electronics. I need to start ha
Electronics Forum | Fri Aug 26 21:23:38 EDT 2005 | Jes�s Salinas
Hello , In our case we take the results from the repair station. Each test station has its own repair station so from there we count the process defects : placement and printing. The formula used to calculate PPM = DEFECTS / (PARTS PER BOARD x UNITS
Electronics Forum | Wed Aug 24 22:53:34 EDT 2005 | mrduckmann2000
We have a customer that is using the new Hirose connector p/n df30fc-40dp-0.4v. The connector has lead spacing of .4mm. I beleive that if I have a stencil cut to 2-3 mil I should have enough solder paste to solder the connector to the PCB pads. Ho
Electronics Forum | Tue Aug 30 10:46:27 EDT 2005 | lyrtech
Hi, I curently have an interesting challenge. But I don't have all the knowledge to solve it. One of our boards is used in RF applications. We noticed that the No-Clean flux residue makes interferences in the RF signal. Removing the flux residue so
Electronics Forum | Wed Aug 31 11:02:28 EDT 2005 | Jason Fullerton
We are using one BGA that has 7 mil bumps on a 20 mil pitch. We use the manufacturer's recommended pad and aperature layout, which is an 11.8 mil square overprint on a 6 mil land. At 11.8 square, you need to use a 4 mil laser cut or a 5 mil e-form st
Electronics Forum | Fri Sep 02 14:15:44 EDT 2005 | Mika
Check the dimensions of the components in question with a caliper and put the correct numbers in Your part data. Check that the correct nozzle is being used. Also make sure that you have the right pcb height in Your program. This is somewhat criti
Electronics Forum | Fri Sep 09 17:41:58 EDT 2005 | Wild Bill
Reflow and wave flow solders have to be changed more often because of contamination. Pb free PCB's don't solder as well so you will likely have to find a new process or supplier. The higher temperatures heat soak the components so they all need to be
Electronics Forum | Fri Sep 02 05:17:54 EDT 2005 | pyramus
I have another question can anybody assist me. Is there any specific procedure or guidelines that need to be followed for handling PCB (OSP & Immersion Tin)? Moisture Sensitive Devices? or how about throw-out or left over parts? Is there any paste h
Electronics Forum | Thu Sep 08 03:18:10 EDT 2005 | dougs
Don't know if you'd be able to register as i'm not sure if you need to have a service contract or not but if you can go to the UIC website and register for the knowledgebase, this service has detailed advice on fault finding on universal machines, i'
Electronics Forum | Tue Sep 20 23:12:38 EDT 2005 | darby
Several suggestions. Your hands may be tied but here goes. 1. Doctor your stencil so that pads are not shared etc and reduce the apertures more that what you would normally. This may stop one pad wetting into another etc. 2. The use of a Pb-free sol
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