Electronics Forum | Wed Apr 25 17:44:05 EDT 2007 | Cmiller
WOW, just no innovation here. Nobody thought to sick some suction cup thinggys to is so it can place parts too and a little dispenser so it can put down paste and yea, an old convection rework wand and wow, we can do SMT and AOI. GOD, what was I thin
Electronics Forum | Tue May 01 16:36:12 EDT 2007 | ratsalad
I have been working with GSMs since 1999. Mostly, I've been programming them but for the past 2 1/2 years or so I've also gotten to know them mechanically. I think they are great machines. If you are looking at Flex head GSMs (4-spindle) they won'
Electronics Forum | Wed May 09 13:37:07 EDT 2007 | jmills
Greetings Tried to search past threads without an answer. I have a resistor that just fits the between pads. Some of the resisitor were installed without the termnation sitting on the pad and are infact sitting on solder a good .020 to .025 above th
Electronics Forum | Mon May 14 13:33:36 EDT 2007 | jax
Solderability!!! The CM in question has probably seen too many solder problems with White Tin in the past. We have had the same issues. To save us from spending too much time and money(verifying pure Tin plating thickness, Chemical leaching from th
Electronics Forum | Fri Jun 08 13:49:11 EDT 2007 | ck_the_flip
From my past experience, you can usually get away with OUT the chip wave if your SMD's are no smaller that 0805, and more importantly, there are no SOT23's. A nice, clean, inerted laminar wave (with a little smart or omega help) will solder your S
Electronics Forum | Mon Jun 11 10:40:46 EDT 2007 | ramseyn
Jim, Another good resource would be Asymtek (www.asymtek.com) I have had a lot of luck with their dispense equipment for underfilling applications. They have run tests in the past using various methods for our company to determine what type of epoxy
Electronics Forum | Thu Jun 21 20:08:01 EDT 2007 | davef
Roland I read the article in the New York Times hard copy within the past two weeks. Maybe one of these: * http://query.nytimes.com/gst/fullpage.html?res=9907E5DF163AF933A25751C1A9649C8B63&sec=&spon=&pagewanted=2 * http://www.boston.com/business/g
Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10
It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often
Electronics Forum | Fri Jul 20 07:25:51 EDT 2007 | chrispy1963
If you still have trouble with this problem try calling MyData and ask their opinion. I know this sounds simple and maybe you have tried already, but I have found in the past that there are certain techs who really know their stuff. Glen Gayton in B
Electronics Forum | Wed Jul 25 11:55:21 EDT 2007 | ck_the_flip
Zoinks!! Doing the homeplate design on 0402 will actually make your tombstones WORSE! Think about it. Your wetting forces are now on the ENDS of the device with no solder paste toward the middle of the device to tack the part down - a gauranteed f