Electronics Forum: past (Page 756 of 989)

Chip Component Stacking

Electronics Forum | Sat May 06 06:19:36 EDT 2017 | rob

You could also try some of the 3D MID placement machines - some have dispense heads in with the placement heads, so theoretically you could place on the PCB paste, dispense on the terminals. and place the new part. Yamaha/I-Pulse do a couple: https:

"R" type solder paste

Electronics Forum | Thu May 11 11:25:56 EDT 2017 | davef

Key to Rosin Fluxes [from SUPERIOR FLUX & MFG. CO.] Type R (Rosin): Non-activated rosin flux for soldering copper. Residues are non-corrosive and non-conductive. Type RMA (Rosin Mildly Activated): Mildly activated rosin flux that contains no chlori

Waves soldering: not enough solder remaining on pads

Electronics Forum | Tue May 23 02:41:37 EDT 2017 | zsoden

Thanks Bukas. I've actually gone to a lot of trouble over the past 24 months to completely clean, rebuild and adjust the pump and nozzle assemblies and even through all of that we've still never been able to get theoretical maximal wave height from t

Waves soldering: not enough solder remaining on pads

Electronics Forum | Tue Jun 06 11:47:33 EDT 2017 | stevezeva

Hi Zac, was that board finished with tin/lead HASL or leadfree/HASL? Also what type of flux were you using? Just because a board is fresh out of sealed packaging doesn't necessarily mean that it's going to solder well. The picture that I've attached

IPA versus Stencil Cleaning Solution

Electronics Forum | Tue Jun 13 15:03:54 EDT 2017 | mmjm_1099

For many moons, I have used IPA for our cleaning tanks within out DEK systems. Now we have a new engineering team and he would like to try a stencil cleaning solution (DEK PRO XF). Can everyone tell me there pros and cons of using each of these over

Custom Nozzle Supplier for Universal Genesis

Electronics Forum | Tue Jun 20 17:23:04 EDT 2017 | snevermind

I have a stamped steel battery contact to pick that has a pick location 11mm deep in the tape. The factory machine settings only allow 6.6mm of "over-drive" depth past the top of the carrier tape. Based on that, I will need a custom nozzle that is

PCB stretch

Electronics Forum | Fri Jul 07 12:44:49 EDT 2017 | tsauve

The problem is registration between the stencil & the smallest pads on the 5 substrates. Using SPI s/w I can overlay the paste layer over the PCB image to determine stretch/shrink. Our worst case was shrinkage of 10.2mil on a 5-up 300mm panel - small

PCB damage in Water Cleaner

Electronics Forum | Fri Jul 28 11:16:09 EDT 2017 | robertwillis

Yes it happens with any inline cleaner with small or light boards the pressure can cause them to flip. If they lodge in the links they can also cause damage to the conveyor. For small boards, flexibles etc you do need a mesh fixture of some sort or l

Tombstone components issue after reflow?

Electronics Forum | Thu Aug 17 12:18:40 EDT 2017 | cyber_wolf

I do not see anything obvious that would cause a thermal mis match. Regarding reflow profiles reducing tombstoning, Unless there is something wrong with your paste or you are running smaller than 0402's, I have NEVER seen a reflow profile reduce tom

Tombstone components issue after reflow?

Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics

The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi


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