Electronics Forum: past (Page 866 of 989)

Contaminate PCB surface

Electronics Forum | Sun Nov 27 05:06:25 EST 2011 | siaomuay

Hello I'm just study PCB in my company. I found many Surface PCB have some contaminate and can not specify what it is. Size is around 2 mm2 . Sometime I send to supplier and they said it is solder paste or some dirty flux. please see contaminate1

Soldering wires to through holes

Electronics Forum | Wed Dec 07 17:43:31 EST 2011 | mikenil

Hi I do not work for a board house but a manufacturing facility where we do a considerable amount of soldering wires to through holes. We pretin our through holes on both sides of the PCB prior to reflowing the solder and installing the conductor (w

X-Out Board

Electronics Forum | Fri Feb 17 11:48:25 EST 2012 | davef

Here's a link to an earlier thread on SMTnet that may add something to the conversation http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=20871 Allowing fabricators to X-Out boards is a bad idea. * X-Outs are randomly placed * Machines can

solder paste for 200 degs c continuous operation?

Electronics Forum | Wed Mar 21 11:42:54 EDT 2012 | davef

Downhole solder suggestions, in order of preference are: * Kester Sn96.3Ag3.7. Most vendors do not stock straight tin-silver alloys, whose wallet is that fat? * SAC305 can usually be used in place of one of the copper-free tin-silver alloys in downho

solder paste for 200 degs c continuous operation?

Electronics Forum | Wed Mar 21 13:16:11 EDT 2012 | grahamcooper22

What solder alloy are you using at the moment which is coming to the end of its limits ? Normally in general for safe operation of an alloy we don't like to recommend any operation temp that is higher then two thirds of the solders melt point, but th

Solder Fountain Recomendation

Electronics Forum | Thu Mar 29 07:37:45 EDT 2012 | davef

The current discussion about solder fountains has to do with copper dissolution. Broadly, copper dissolution is the weakening of copper traces where a trace and a barrel plating intersect due a loss of the copper into the solder. Longer contact time

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101

Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo

Underscreen cleaning cycles

Electronics Forum | Fri May 11 14:54:38 EDT 2012 | stentech

I am not aware of the Nano protek flaking off. However I do believe it can wear off through abrasion. Unforunately there is no red light goes off when it has worn unless you have good paste inspection. Even when it wears it will not take you to a neg

Underscreen cleaning cycles

Electronics Forum | Thu May 17 09:20:10 EDT 2012 | stentech

there are many reasons why FG and Nano are used and many papers written on them. Nano ssems to be the topic of interest right now. I agree it is mostly for printing fine and untra fine pitch. With that comes under stencil wiping to keep the stencil o

How to define solder paste printing height tolerance

Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef

Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u


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