Electronics Forum | Tue Jan 20 20:09:33 EST 1998 | Mario Lapointe
SMT-ASSY is a training center located in Montreal, Canada. We are currently looking for representation in these area: Maine, New Hamphire, Vermont, up to Connecticut. SMT-ASSY offers many different training programs for though hole and surface moun
Electronics Forum | Mon Oct 16 16:30:27 EDT 2023 | yannick_herzog
@MagyarT the error occurred across multiple PCBs throughout the entire job. So, for example, the issue isn't limited to just the first printed one but spans the entire duration. At what dimensions would you recommend a division? The apertures on the
Electronics Forum | Mon Aug 24 21:04:58 EDT 1998 | Karlin
| | Hi, | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | We have rule out the possibility of not printing any solder
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Wed Jun 12 08:24:03 EDT 2002 | davef
Tough. 0402 capacitors are more prone to tomb stoning than resistors. Tailor your process to the 0402 and let the other stuff fall where it falls. Search the fine SMTnet archives for discussion on tomb stoning. Consider: * Changing paste. * Apply
Electronics Forum | Sat Jul 16 08:12:44 EDT 2005 | davef
skandaae: By "tilt" do you mean that one end of the 0603 has lifted from the board surface? If so, we call this "tombstone". In general, tombstoning is caused by an imbalance in temperature or forces on the component. * Convince yourself about the
Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis
There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======
Electronics Forum | Wed Apr 11 13:32:26 EDT 2001 | slthomas
I think we've miscommunicated....I don't use that thing for measuring paste height or volume as part of the process because it's not repeatable from one operator to the next. I use it more to measure radial tape and reel parts against EIA-486, actual
Electronics Forum | Fri Apr 13 14:08:53 EDT 2001 | CAL
Proper setup and cleaning of stencil helps ensure repeatable printing performance. Cleaning processes need to be compatible with materials used in the manufacturing of stencils and solder paste. IPC 7525 should also help you out. We here would Inspe
Electronics Forum | Fri Aug 09 11:59:31 EDT 2002 | bcceng
Tom, I developed a process for applying solder bumps on BCC32 and BCC48 successfully on my previous employer. The quantities were in the thousands a week, the following process is what I was using: Insert BCC's on process carrier (carrier holds 500
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