Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Mon Jan 04 23:15:35 EST 1999 | Kris Ewen
Where I worked, we used 0.014" square aperatures (several mfgs. have proven the benefits of square & I've seen a better transfer efficiency myself). Some mfgs use smaller edge lengths & have had success. 0.005" thick stencils give better transfer e
Electronics Forum | Mon Mar 28 08:56:26 EDT 2011 | cvoyles
Where you inspect depends on what you're looking for. X-Ray is a fairly specialized piece of gear and doesn't lend itself for example to paste registration or thickness measurement. A laser system is better suited. An X-Ray system would allow you to
Electronics Forum | Tue Sep 22 06:07:02 EDT 1998 | jacqueline coia
need advice to point me in the correct direction for solution to the problem of unsoldered joints which look soldered under normal visual inspection, but when pull strength test is performed the leads are coming away from pad, no strong intermetallic
Electronics Forum | Wed Aug 29 20:48:09 EDT 2001 | Jones
I know this is not the answer to your question but it may help until you get the right cleaning process in place. I have found that kneading the paste with 3-4 double strokes during the first print has aided in bring our defective ppm down somewhat.
Electronics Forum | Thu Dec 20 11:09:57 EST 2001 | stevearneson
Also check out the ASC International machine called VisionMaster. This true 3D inspection system has been around for at least 3 years. It provides the highest level of paste measurement in its class. The software is also very easy to operate. The
Electronics Forum | Tue Sep 17 15:03:33 EDT 2002 | ccross
I am working with fine pitch components (15-20 mil) and having soldering problems and would appreciate some opinions. 1) How much of an effect does pad size have on bridging? 2) How much of an effect does solder paste grain size have? What is the re
Electronics Forum | Tue May 03 20:01:24 EDT 2011 | city4497s
It a recent occurance and it happen randomly on other area. I'm using senju M705-GRN360-KV and Indium SMQ 90 Leadfree solder paste, we have been using both paste for 4~5 years. We have asked the oven supplier to perform maintenance and inspection, pr
Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
Electronics Forum | Mon Mar 31 17:28:20 EST 2003 | DEK User
The auto recovery can be set such certain fails trigger automatic actions such as re-print, clean screen, auto paste dispense, etc.
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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