Electronics Forum | Sat Oct 19 04:18:17 EDT 2019 | SMTA-Davandran
Dear Dave, Thank you for your advice on this issue. Shall butt connector withstand high mechanical strength after increase paste volume.
Electronics Forum | Tue Nov 26 18:35:20 EST 2019 | slthomas
It's hard to tell from the image but it looks like there isn't much room for a heel fillet. Seems like that could contribute to your voiding (or poor wetting) if there isn't enough paste volume there.
Electronics Forum | Wed Jul 09 13:48:03 EDT 2003 | russ
Sam, You may want to be careful with your analisys, reducing paste volume also reduces flux volume. Flux is there to promote and aid in wetting. by reducing flux you may have initiated the poor wetting yourself with the experiment. Just anothe
Electronics Forum | Mon Apr 04 18:23:35 EDT 2005 | GS
Solder volumes is very important parameter to keep under control in order to get a good and reliable CCGA solder joint, and an automatic 3D paste volume inspection is strongly recommended practice to use. Questions: - what Column pitch do your CCGA h
Electronics Forum | Wed Aug 09 08:46:48 EDT 2006 | pavel_murtishev
Good afternoon, Take my word, bent THT leads will surely cause problems with manual/automatic component insertion, and surely will create voids in solder joints. As a rule, PIH components are placed by hand and good PIH THT manual component placemen
Electronics Forum | Thu Mar 08 18:39:06 EST 2007 | elias67
Stencil Thickness should be .005" A reduction along with cross hatching is a must for the center pad to reduce paste volume as well as to assure even paste deposit while printing on a large pad. With out the cross hatch, the squeegie will most like
Electronics Forum | Thu Mar 04 20:15:51 EST 2004 | davef
Print paste in the holes you don't plan to use and let it dry. That way you don't affect your paste volume in other apertures. The bad news: When you don't want paste to dry and close your apertures, it will do it. When you want paste to dry and
Electronics Forum | Thu Nov 08 10:26:12 EST 2007 | slthomas
"1/2 of the paste volume is lost from the flux and carriers being removed during the reflow." Don't forget the intersticial space between your solder spheres that you lose during reflow. Not being of an engineering background I couldn't begin to a
Electronics Forum | Thu Oct 26 08:48:06 EDT 2000 | ptvianc
Of all of the process steps, paste printing is the most critical with respect to minimizing defects. Therefore, paste printing must be tightly controlled, particularly in the case of fine pitch (peripherally leaded) devices and BGAs. I believe that
Electronics Forum | Tue Feb 08 03:14:37 EST 2000 | Roni H.
Hi Jose, J-lead are very sesitive to coplanarity, which is the major cause for the defect you described. Other posibility is that there is not enough solder paste ; J-lead need around 10% more solder past then L-lead, You have to consider the screen
