Electronics Forum | Mon May 20 16:15:48 EDT 2019 | davef
Resources are: * IPC-7525A - Stencil Design Guidelines, 3.5.2 Step-Up Stencil This type stencil is useful when it is desirable to print thicker solder paste in a small portion of the stencil. An example would be a ceramic BGA where it is necessary t
Electronics Forum | Wed Mar 03 07:29:34 EST 2004 | pjc
2D will give you on-line contrast inspection for paste coverage on the land. I would go with 2D on the printer when comparing to an AOI that will do the same contrast inspection. There are systems out there that will check paste hieght and area cover
Electronics Forum | Wed Dec 15 16:20:48 EST 2004 | darby
I read with interest in September Circuits Assembly magazine an article entitled "Reducing Variation Through 'Intelligent' Stencils. In this the authors propose that by REDUCING stencil thickness from 0.005" to 0.004", the paste deposit volume will I
Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
Electronics Forum | Thu Nov 13 10:05:18 EST 2014 | grimus
Hello, I'm fighting with problems of random solder balls that appears after reflow soldering around Pin in Paste component. I'm mounting this component with Pick and Place machine. I'm using solder paste type-3 and this is lead free product. This is
Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain
Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no
Electronics Forum | Wed Aug 26 12:06:44 EDT 2009 | clampron
Good Morning, I have been struggling with this part for some time now. I have to agree that whoever designed this part, did not have to manufacture with it. We have advanced to a point where they have a acceptable yield but I believe that will be hi
Electronics Forum | Wed Jun 22 18:52:56 EDT 2011 | semiconjt
tTo explain what I mean...sorry for my bad Engilsh... please find short " patchwork stencil" description from EPP Europe. http://www.epp-online.de/europe/-/article/16537487/15944614/Innovators-of-laser-processing-technology /art_co_INSTANCE_0000/max
Electronics Forum | Wed Dec 05 03:33:22 EST 2007 | longlee
We have done Paste-In-Hole process for 4 years.I think this prcess is suitable for 28-pins connector. Of course, you must assure the connecotr can endure high temperature firstly.Secondly, you need calculate the volume of solder paste, you can refere
