Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Tue Dec 08 08:52:42 EST 2009 | cunningham
How do people prepare there solder paste for screen print? We currently remove them from the fridge and mix them in a 500g solder paste tub mixer to mix the flux and paste together we waste to much paste at the moment as we only use the tub for 1
Electronics Forum | Fri Jun 08 05:44:49 EDT 2001 | ianchan
Hi Dave F, thanks for the reply, what I did was evaluate, the ASC International, 3D solder paste VOLUME m/c, thru a local s'pore vendor, and this sales-guy is pulling a rip-off, coz his knowledge of the m/c seems inconsistent. I had sent ASC a emai
Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef
Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.
Electronics Forum | Wed Sep 12 14:08:37 EDT 2001 | caldon
PLEASE!!!! If that were the case then a 6 mil stencil is not a 6 mil stencil depending on paste, pressure, snap off...... We have and use the LSM 300 paste inspection to great degree of success (esp. for solder paste on semiconductor devices). So w
Electronics Forum | Mon Jun 12 22:11:11 EDT 2006 | danielchankh
Is there anyone out there who has used fringe pattern image projection vs laser triangulation method for solder paste volume inspection? Need some advice on which is better?
Electronics Forum | Tue Jul 23 17:01:56 EDT 2002 | russ
Did you use the frame grabber software that is available for the LSM? I used one in the past and we also failed the GR&R we then installed this software and it became very consistant unfortubately I cannot remember who sells this software. Anyway,
Electronics Forum | Fri Jan 06 19:57:19 EST 2006 | abhinavajmera
What would be the most suitable expression for ratio of Volume of Alloy to Volume of Paste for a solder paste? For example if we use 63Sn/37Pb alloy with a 90 Wt% metal what would be an appopriate expression for the Volume Ratio?
Electronics Forum | Tue Feb 22 07:58:16 EST 2005 | davef
We hear you. If it's not broken, why fix it? Right? Well intentioned, but not very educated customers seems to be part of the bane of existance of process engineers at contractors. First, as a previous poster said, paste height is an improper mea
