Electronics Forum | Tue Jan 22 13:48:49 EST 2013 | smtequip
I would not consider KISS unless you have a limited budget and very low production volume as they are not well built enough to be considered "production" machines. That means they will not last as well as a machine from ERSA, Seho, or EBSO which coi
Electronics Forum | Fri May 11 20:55:51 EDT 2018 | jlawson
Rehm Thermal Systems (Germany)offer in process vacuum reflow in convection ovens and vapor phase pending what makes sense - volumes of PCB per hour needed. There are other vendors getting into this of course. Can only get single digit void free join
Electronics Forum | Mon Sep 10 16:55:29 EDT 2018 | wrander1
Hi, I am looking for a Solder jet supplier. Micronic does not support my small dot size LEADED solder paste. I can not use stencil print because my substrate is fragile. I need a run rate of 10,000 dots per hour and 99.99 % dots +- 10% volume. Equip
Electronics Forum | Mon Nov 26 13:40:40 EST 2018 | robl
Hi Prem, Yes, the flux in the Cobar paste helped with wetting and joint strength, as does reducing voids as there is more solder in the joint, as does cooling rate. Regarding peel test in KG, it depends on the pad size and volume of solder in the j
Electronics Forum | Wed Jan 26 10:43:32 EST 2011 | grahamcooper22
From our experience with our gel fluxes the depth of the flux cavity can be 30% ~ 70% of the ball diameter. You'll probably need to do some tests to find the optimum for your process. If you have really fast movement on pick and placement machine the
Electronics Forum | Wed Feb 03 18:32:07 EST 1999 | Earl Moon
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Thu Jul 01 13:57:57 EDT 1999 | Kris Wiederhold
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Tue Aug 02 15:05:38 EDT 2011 | davef
A couple of points: * Just a nit, 'screens' fell in disuse 10-15 years ago. Old habits die slowly don't they? * Yes, DEK and MPM each hold about 50% of the solder paste printer market and about 4 or 5 others hold the rest. SOLDER PASTE PRINTER EQUI
Electronics Forum | Fri Sep 15 15:51:53 EDT 2006 | MFG CAVEMAN
We have a new product that uses an SMT edge connector. The process we are using is as follows: -Screen print side 1 (no paste on connector pads) -Place Rs & Cs -Reflow -Screen print side 2 (paste on connector pads) -Slide connector into side 2 wet
Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W
There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.
