Electronics Forum: paste and thickness and bga and stencil (Page 1 of 6)

Re: screen printer and stencil printer

Electronics Forum | Wed Aug 18 21:10:23 EDT 1999 | se

Hi, I'd like to ask some tips about the merits and shortcomings o of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our application? The board

Re: screen printer and stencil printer

Electronics Forum | Wed Aug 18 17:59:09 EDT 1999 | Mik Horvath

Hi, I'd like to ask some tips about the merits and shortcomings o of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our application? The boards contain

Re: screen printer and stencil printer

Electronics Forum | Wed Aug 18 18:10:33 EDT 1999 | Mik Horvath

Hi, I'd like to ask some tips about the merits and shortcomings o of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our application? The boards contain

Differences between screen and stencil printing

Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon

Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)

Re: screen printer and stencil printer

Electronics Forum | Wed Aug 18 15:20:25 EDT 1999 | John Thorup

Hi, I'd like to ask some tips about the merits and shortcomings o of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our application? The boards contain no BGA and

The specification of Paste deposition thickness and volume

Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef

Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 15:27:00 EDT 2001 | jimlew

We do some aperture reductions - but it's not the 10% i'm accustomed to. Looks like it should be more than we currently do (I think we do 10% of length, but no width). Don't think we have a slumping problem, and we're not doing snap-off, only contact

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs

Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 08:41:56 EDT 2001 | jimlew

For those of you out there, like myself who are still using 2-d to measure paste ht, I have 2 questions. 1. Typically, what tolerance are you applying to your ht? +- 1 mil, or what? 2. Are you using metal squeegees, and if so, have you found that squ

CCGA and overprinting?

Electronics Forum | Mon Oct 15 12:42:36 EDT 2001 | davef

I hate getting "roped" into math stuff, but here I go again ... Area of aperture = volume of paste / stencil thickness = {[5000 mil^3] / 5 mil} = 1000 mil^2 Side of the square aperture = Sqrt of the area = [1000 mil^2]^1/2 = 32 mil Diameter of ape

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