Electronics Forum | Thu Mar 15 13:27:45 EDT 2007 | Pete
We had a customer do a similar thing. We notified our customer and educated them on what was happening. We were instructed to try one and report on the results, as the vias were supposed to be filled (and weren't). We pasted and reflowed and as su
Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef
Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr
Electronics Forum | Tue Sep 17 10:01:56 EDT 2002 | yngwie
Thanx for the proposal...but Dave I'm not able to link to PCD's Sites past issues 11/98, that you were suggesting. Is there anyway that I can get a copy of the said articles ? Appreciate your help and thank you in advance... cheers.. yngwie
Electronics Forum | Sat Sep 14 01:34:19 EDT 2002 | Yngwie
I have the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcoming designs? 2) What are the manufacturi
Electronics Forum | Tue Sep 17 00:40:39 EDT 2002 | yngwie
Hi all Experts, Desperately need your help on the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcom
Electronics Forum | Tue Sep 17 08:26:28 EDT 2002 | davef
Try: "Increasing Density By Placing Vias In Lands"; Blankenhorn, JC; 'Printed Circuit Design'; 11/98
Electronics Forum | Sat Mar 27 08:15:02 EST 2004 | davef
Via in pad is a designer's dream and an assembler's nightmare. Search the fine SMTnet Archives for previous discussions to get started. VIP, via-in-pad, or whatever tend to promote voiding within the via and certainly partially starved solder conne
Electronics Forum | Sat Oct 12 05:40:05 EDT 2002 | Kenture
Hello All, I am having issued with insufficient solder due to via in pad. It is a 10 mils via and PCB is 70 mil thick. Six mils stencils was used since there are some 20 mils (No clean process). Any recommendation? Thank you.
Electronics Forum | Wed Feb 27 19:55:13 EST 2002 | nifhail
Hi, I need help to understand further on the via in pad for 0402 requirement. If I were to do the DFM over the brd design which consist of 0402 with via on pad, what is the criteria that I should look for ? I learned that the via in pad does not wor
Electronics Forum | Tue Oct 15 15:16:34 EDT 2002 | Abelardo Rodriguez Santana
We run into that issue all the time. If a corrective action must be done right away. Place Kapton tape on the bottom side of the board to cap off the via. If you have room to place tape if not use pink lady or something to plug the via. And weathe
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