Electronics Forum: paste thickness bga stencil (Page 1 of 93)

stencil thickness for bga

Electronics Forum | Mon Oct 13 13:49:29 EDT 2003 | mrmaint

Does anyone know of a standard stencil thickness for BGA'S. We currently use 4 to 5 mil stencils depending on component mix. Is an aperature reduction required for BGA'S. If so what percentage. Any help would be greatly appreciated. Thanks MRMAINT

stencil thickness for bga

Electronics Forum | Mon Oct 13 19:04:47 EDT 2003 | davef

Aperture size should vary with the component [pitch]. That size should be the same a the pad size. So, generally pinching is not required. Indium discusses BGA apertures on their site [ http://www.indium.com ]

mirco bga stencil opening

Electronics Forum | Wed Sep 25 11:11:14 EDT 2002 | xrayhipp

Try .005 or even .004 thick laser cut electopolish stencil and reduce grain size of paste. Go with 400 or 25 in the case of AIM. We had a similar prob.

mirco bga stencil opening

Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton

We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac

mirco bga stencil opening

Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck

Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks

mirco bga stencil opening

Electronics Forum | Thu Sep 12 09:15:29 EDT 2002 | mhoughton

I have printed and placed similar devices in high volume with exactly this spec for a couple of years with no problems, are you using laser cut stencils and what type of solder paste are you using? and what is the end use of the product as it may nee

mirco bga stencil opening

Electronics Forum | Thu Sep 12 09:12:22 EDT 2002 | mhoughton

I have printed and placed similar devices in high volume with exactly this spec for a couple of years with no problems, are you using laser cut stencils and what type of solder paste are you using? and what is the end use of the product as it may nee

0603 - stencil thickness

Electronics Forum | Fri Jan 03 12:01:46 EST 2003 | jax

Alot of the companies out there use Standards developed internally, centered around there paste, equipment, and reflow processes. Normally you will see either 5mil or 6mil stencils used for everything in house with the exceptions of specific boards.(

0603 - stencil thickness

Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef

Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,

Step-up stencil: recommendation thickness

Electronics Forum | Mon May 20 16:15:48 EDT 2019 | davef

Resources are: * IPC-7525A - Stencil Design Guidelines, 3.5.2 Step-Up Stencil This type stencil is useful when it is desirable to print thicker solder paste in a small portion of the stencil. An example would be a ceramic BGA where it is necessary t

  1 2 3 4 5 6 7 8 9 10 Next

paste thickness bga stencil searches for Companies, Equipment, Machines, Suppliers & Information

MSD Dry Cabinets

Inspection mirrors for electronic rework and repair.
Webinar DI-WATER VS CHEMISTRY

Best Reflow Oven
SMT feeders

ONLINE IPC Training & Certification
Selective Conformal Coating System - GPD SimpleCoat

Easily dispense fine pitch components with ±25µm positioning accuracy.
Accurate and consistent volumetric Dispensing System Solutions for 1- and 2-component fluids with ASYMTEK Vortik family of pumps. Learn more.

PCBA services - from simple board assembly to complex product development and testing