Electronics Forum: patterns and sir (Page 1 of 9)

Land patterns for 0612 and 0508 capacitors

Electronics Forum | Tue Nov 30 15:38:27 EST 1999 | Wendy Casker

Hi, I am looking for land patterns for 0612 and 0508 chip capacitors. Because they are not standard (yet) package sizes, i am having trouble finding a standard land pattern. (If you don't know what these are, picture a 1206 or an 0805 with the te

Re: Land patterns for 0612 and 0508 capacitors

Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau

hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:

Re: Land patterns for 0612 and 0508 capacitors

Electronics Forum | Tue Nov 30 17:07:42 EST 1999 | Dave F

Wendy: The IPC-SM-782 Pad Calculator (www.ipc.org/html/fsresources.htm) should be able help you solve your problem. Good luck Dave F


Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem


Electronics Forum | Wed Aug 21 10:26:08 EDT 2002 | stownsend

We are using OSP coated boards and no-clean solder paste. In a few instances, we are seeing increased distortion in an audio circuit. Has anybody seen or heard of surface insulation resistance (SIR) decreasing after reflow on OSP boards? Is it possib


Electronics Forum | Thu Aug 22 22:07:44 EDT 2002 | davef

Did the techs have a restful night?


Electronics Forum | Thu Aug 17 18:03:51 EDT 2006 | Nirmal

Dear Sir, Any buddy can explain what is different with PBGA and CBGA..


Electronics Forum | Wed Aug 21 19:22:44 EDT 2002 | stownsend

Splitting hairs is putting it mildly. I�m just trying to rule out all variables. It doesn�t appear that we have an SIR problem, but since the newest variable is OSP (blame the new guy for all the problems), I have to consider it. I�ve seen this befo

BGA and Land Patterns

Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank

BGA lands and ICT

Electronics Forum | Wed Mar 20 15:18:09 EST 2002 | angiewest

You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org Good Luck

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