Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly
Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a
Electronics Forum | Thu May 20 03:45:22 EDT 2021 | jineshjpr
SAC305 Will be the best choice with minimum TAL, Maximum Soak Solder Profile. Surely your solder Joint strength also will be more reliable & This can pass any kind of reliable Tests.
Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm
Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate
Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101
Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo
Electronics Forum | Wed May 24 15:59:34 EDT 2006 | JohnM
I have a product with mixed in Pb free and Pb BGAs. I decide to use SnPb paste with Pb free reflow profile to make it work for both types of BGA. Do I have a reliability solder joint issue by using this method? How is your opinion on this case? Can
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Wed Jul 24 10:07:44 EDT 2019 | ameenullakhan
Hi Team, Can anyone suggest me best stencil opening for CCGA. Attached is the component details. Solder paste : water solube - ORL0 - Jtsd 001 ( Sn63/Pb37) Any one has qualified the same. Regards, Ameen
Electronics Forum | Mon Jun 27 09:09:19 EDT 2005 | Bob R.
We've all been soldering Pb free parts for a couple decades. All your surface mount capacitors have probably had a Sn finish for years. Whenever one of our parts with a SnPb finish converts for Pb free we have the manufacturing site do a small buil
Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef
I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does
