Electronics Forum: pb36 (Page 1 of 6)

Sn62Pb36Ag2

Electronics Forum | Thu Dec 02 07:40:54 EST 2010 | scottp

2000 cycles of -40/+150C thermal cycling.

Sn62Pb36Ag2

Electronics Forum | Tue Nov 30 17:47:25 EST 2010 | ck_the_flip

1.) Are there any industry white papers written that document any advantages in running this alloy? From what I've read, this alloy was formulated to prevent leaching of silver for silver-bearing component terminations. 2.) Are there any concerns w

Re: 2% silver solder paste

Electronics Forum | Thu Apr 15 09:45:34 EDT 1999 | Terry Keen

We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t

Re: 2%Ag?

Electronics Forum | Wed Jan 13 22:01:42 EST 1999 | Dave F

This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? Thanks! Jenna: We've used

SnPb reworked with SnPbAg ?

Electronics Forum | Tue Mar 20 06:09:20 EDT 2007 | d0min0

Hi, can't find answer to my question on web - maybe someone can help would it be compatible to use a wire of Sn62Pb36Ag2 for a product made with Sn63Pb37 paste ??? regards

2%Ag?

Electronics Forum | Mon Jan 11 16:16:52 EST 1999 | Jenna Sweterlitsch

This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? Thanks!

Re: 2% silver solder paste

Electronics Forum | Thu Apr 15 08:21:47 EDT 1999 | Terry Keen

We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to

Reflow issues with leaded paste and mixed components

Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef

When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.

RF BOARD + SOLDER PASTE TYPE PROBLEM

Electronics Forum | Sun Nov 04 01:04:04 EST 2007 | omidjuve

we are manufacturing some rf boards that works on a high frequency margins now our boards doesn't pass in impedance test and we concluded that the problem might cause by the solder paste that we are using . our solder alloy is sn62/pb36/ag2 and we t

Tin Lead Silver BGAs

Electronics Forum | Tue Apr 26 07:56:12 EDT 2016 | joelperez

Hello SMTnet team, I have read before that silver content on solder joints is ok at around 2% total silver content. Does anyone has experience using SN62/PB36/AG2 BGAs on hard gold (10 micro inches) PCB surface finish? Any drawbacks? Thanks Joel

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