Electronics Forum: pb90 (Page 1 of 1)

MLC reflow using high temp Sn10Pb90 solder balls

Electronics Forum | Mon Nov 12 15:21:09 EST 2012 | davef

High-temp ball Sn10Pb90 + eutectic solder paste is common place for MLC reflow. Temperatures necessary to alloy the high-temp ball Sn10Pb90 and eutectic solder would be high enough to compromise interposer, board and many components. What are your:

thermocouple attachment solder

Electronics Forum | Thu Nov 01 15:39:29 EDT 2007 | pjc

Here's what I use: Sn10/Pb90, 268C-302C

MLC reflow using high temp Sn10Pb90 solder balls

Electronics Forum | Thu Nov 08 10:52:22 EST 2012 | Bryan Ng

I am considering using high-temp ball Sn10Pb90 + eutectic solder paste for MLC reflow (no underfill). You can see that there is no Intermetallic bond for the paste and the balls. Under high stress/shock condition, the solder joints develop micro c

Reflow with Sn/Pb=90/10 with Golden Palting PCB

Electronics Forum | Sat May 28 04:56:23 EDT 2005 | WDLau

Dear, I am looking for the supports, specification, etc of the solderiability of Hot bar Reflow process with: A). FPC plating with sb/pb= 90/10, to be mounted to B) B). Golden plating PCB Please kindly input, As far as I know the melting point of

Thermo couple attachment

Electronics Forum | Mon Mar 21 10:43:07 EST 2005 | py (france)

two ways to attach a thermocouple first with hig temperature alloy (for example Sn Pb90) it's not very easy to inclose the thermocouple in the solder because the wetability of the thermocouple is awfull. the second one: attach the wire of the thermoc

No Lead BGA Hot Gas Rework

Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken

I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col

Oven Profile:Thermal Couples Letting Go

Electronics Forum | Fri Feb 03 17:25:47 EST 2012 | tombstonesmt

We've been having issues with our current process of oven profiles. We use a high temp adhesive to bond the thermal couples to the desired components. The issue of them letting go or releasing during reflow temps are hit or miss. Majority of our buis


Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip

Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter


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