Electronics Forum: pbga crack (Page 1 of 2)

pbga substrate crack vision system

Electronics Forum | Thu Sep 24 06:30:28 EDT 2009 | cathtee

Is there any vision system to check for substrate crack?

pbga substrate crack vision system

Electronics Forum | Thu Sep 24 09:25:24 EDT 2009 | davef

What do you mean by "substrate?" Is it: * Semiconductor die * BT circuit board interposer Is the BGA package: * Encapsulated * Mounted on a circuit board

pbga substrate crack vision system

Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef

From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject

Baking time for PCBA rework

Electronics Forum | Tue Apr 23 18:34:45 EDT 2002 | mkallen

My first posting was not very clear -- sorry. Let me try again. What I want to know is: can I eliminate the drying (baking) process completely IF I know that the good parts (i.e., those not being reworked) are going to stay under some threshold tem

Stress on PCB during ICT

Electronics Forum | Sat Apr 10 01:11:37 EDT 1999 | forest

Our company is going to use BGA(1.27mm pitch) But I have heard of troubles with P-BGA. It is that cracks occured between solderball and gold plating of PCB during ICT(incircuit test). We know that gold plating of PWB is not good for BGA, so we decide

BGA underfilling

Electronics Forum | Mon Nov 12 10:57:36 EST 2001 | emmanuel

We are to use a PBGA 272 and a PBGA 388. Between 500 and 750 thermal shocks (-45�C/+125�C), we have noticed that some cracks appear in the solder joints. According to our component specialists, these cracks are due to the whole design (pcb, component

Re: Void in solder bump

Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette

| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat

Re: Void in solder bump

Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman

| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Thu Feb 04 10:00:26 EST 1999 | Terry Burnette

| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa

PBGA vias throwing solder balls

Electronics Forum | Thu Sep 16 18:59:14 EDT 2004 | Carol

Thanks Everyone, the information was very useful. We use 7095 as a bible. A-610 6.5.3 doesn't allow for any solder balls not entrapped/attached etc. so we will look again at plugging/tenting both ends of the via. We ran into the problem of the mask

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