Electronics Forum | Thu Sep 24 06:30:28 EDT 2009 | cathtee
Is there any vision system to check for substrate crack?
Electronics Forum | Thu Sep 24 09:25:24 EDT 2009 | davef
What do you mean by "substrate?" Is it: * Semiconductor die * BT circuit board interposer Is the BGA package: * Encapsulated * Mounted on a circuit board
Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
Electronics Forum | Tue Apr 23 18:34:45 EDT 2002 | mkallen
My first posting was not very clear -- sorry. Let me try again. What I want to know is: can I eliminate the drying (baking) process completely IF I know that the good parts (i.e., those not being reworked) are going to stay under some threshold tem
Electronics Forum | Sat Apr 10 01:11:37 EDT 1999 | forest
Our company is going to use BGA(1.27mm pitch) But I have heard of troubles with P-BGA. It is that cracks occured between solderball and gold plating of PCB during ICT(incircuit test). We know that gold plating of PWB is not good for BGA, so we decide
Electronics Forum | Mon Nov 12 10:57:36 EST 2001 | emmanuel
We are to use a PBGA 272 and a PBGA 388. Between 500 and 750 thermal shocks (-45�C/+125�C), we have noticed that some cracks appear in the solder joints. According to our component specialists, these cracks are due to the whole design (pcb, component
Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
Electronics Forum | Thu Feb 04 10:00:26 EST 1999 | Terry Burnette
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Thu Sep 16 18:59:14 EDT 2004 | Carol
Thanks Everyone, the information was very useful. We use 7095 as a bible. A-610 6.5.3 doesn't allow for any solder balls not entrapped/attached etc. so we will look again at plugging/tenting both ends of the via. We ran into the problem of the mask
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