Electronics Forum | Mon Sep 13 06:23:06 EDT 1999 | Earl Moon
| | We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems wi
Electronics Forum | Fri Jun 18 13:48:37 EDT 1999 | Earl Moon
| We currently use HASL on all of our boards and I would like to move to something else. I have sampled some boards with Entek OSP and I loved it, the problem is we have plated mounting holes on just about every board we make. Does anyone have info
Electronics Forum | Thu Jan 14 13:25:53 EST 1999 | Chrys
| Hi Folks. Has any Process Engineer here done a complete evaluation or controlled experiment for VOC-FREE Flux? Our goal here at CEBUKid, Inc. is to implement a VOC-FREE process. We have all the necessary (OPTIFLUX) spray equipment, and we're cur
Electronics Forum | Mon Feb 22 16:39:33 EST 1999 | C.K.
| | Hi Folks. Has any Process Engineer here done a complete evaluation or controlled experiment for VOC-FREE Flux? Our goal here at CEBUKid, Inc. is to implement a VOC-FREE process. We have all the necessary (OPTIFLUX) spray equipment, and we're c
Electronics Forum | Thu May 28 07:25:58 EDT 1998 | Earl Moon
| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p
Electronics Forum | Thu May 28 05:43:33 EDT 1998 | Earl Moon
| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Mon Oct 11 12:24:07 EDT 1999 | John Thorup
| | Folk's, | | | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | | I was wanting to do a straw poll on you guy's as to the type of resist's yo
Electronics Forum | Wed Jun 03 09:04:19 EDT 1998 | Steve Gregory
Hi Anthony! Earl's right, things can get rather involved when you start discussing ALL the things that affect whether or not a board is going to warp. The way I look at the issue is try to separate the warp issue into two catagories; 1. The board bei
Electronics Forum | Wed Sep 05 08:50:04 EDT 2001 | davef
No arument with others comments about moisture, but taking a different tact, consider that the volitle elements of the solder paste disppear as a function of the amount of time the paste is out of the container. [Maybe as a function of solder paste
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