Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit
Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower
Electronics Forum | Thu Jan 24 20:00:24 EST 2002 | davef
If solder touches gold, you should see solder, rather than gold. Since you see gold, something is wrong. * Is the solder touching the gold? If not, why not? * If the solder is touching the gold, but the gold is not soldering, there is a problem w
Electronics Forum | Fri Jun 09 12:51:52 EDT 2006 | flipit
You can not solder to 30 micro inches of gold over nickel and certainly not 80 microns. You can not with tin lead solder or SAC305 anyway. The upper limit is between 6 and 10 micro inches of gold. This is what ENIG plates to. If you solder to gre
Electronics Forum | Tue Feb 20 07:31:45 EST 2001 | Nick L
0.076 ~ 0.2 um(micron) but our substrate gold thickness is between 0.3~1.2um. Is there any related to the plating process of substrate! And how can they control this thickness?(May be I should ask substrate vendor their controlling limit). If this i
Electronics Forum | Thu Sep 15 02:51:45 EDT 2005 | Joris Groot Koerkamp
In our current process we don't need to dry our pcb's. We use FR4 HASL boards. For the leadfree process we want to use NickelGold plated boards. Do we have to dry these boards for the leadfree process or can we just seal them with silica gel?
Electronics Forum | Thu Nov 30 09:51:53 EST 2006 | Loco
Thanks for the replies, it is getting clearer now. We called a PCB supplier and acted if we didnt know what was what, he actually told us its all the same, chemical, flash, immersion, all the same... It is now getting clearer why we are sometimes ge
Electronics Forum | Thu Sep 27 08:41:15 EDT 2018 | sanneyyu
add tie bar is the simple way to do gold plating on edge connectors, but there's method to remove this tie bars. However,the gold in this way looks not very bright.
Electronics Forum | Sat Mar 15 20:24:13 EST 2003 | ramanandkini
Thanks Mr.Dave. Sorry for the delay. One of our major prolems in ENIG plated surface is that wire does not stick. For many years we were getting a bond strength of 14 grams in both ENIG and electroplated surfaces. Now one vendor supplies ENIG boards
Electronics Forum | Mon Jan 18 10:01:16 EST 1999 | John W
| | | | Folk's, | | | | | | | | I'm looking for information of how long you cna store a gold finish PCB before building it. I know there are problems with the gold disappearing into the underlying nickle over time / temperature etc but exactly how l
Electronics Forum | Mon May 14 18:31:20 EDT 2001 | genny
The experiment was to determine insertions from a > gold plated board into a connector. Same > thickness boards (0.062"), with 100 m base > nickel. � 100m gold =_ 500 insertions � 50 m > gold =_ 300 insertions � 30 m gold =_ 50 to 75 > insertio
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
.gif)
