Electronics Forum | Tue Feb 16 21:29:18 EST 2010 | actioncontrols
I predict you will have no problems with your soldering. Remember that all plating is only a few microns thick and quickly washed away by the molten solder. We have used white tin, immersion gold, OSG, etc. for quite a while with leaded solder and
Electronics Forum | Fri Apr 13 10:34:36 EDT 2012 | bandjwet
1 thickness therefore a DEFECT Does defect violate Min Elect clearance-If YES then defect Make sure you have a dialogue with customer on this one because it will be a repair. The repair itself can be done per IPC7721 procedures. Bob Wettermann B
Electronics Forum | Wed Nov 06 03:51:28 EST 2013 | cuperpeter
Hi rob, Thank you very much for your response. Profiling was made exactly on the pad, which showed dewetting, so the values are mentioned for this pad. PCB's is about a week old. It is possible that the surface of pads is already oxidized? I will t
Electronics Forum | Fri Oct 24 13:00:36 EDT 2014 | markhoch
I'd check into the ASYS LSB-03 Bareboard Destacker. It isn't a gravity drop style. It uses edge clamps to clamp the top PCB on the stack and then drop it on the transport rail. So it doens't destack from bottom to top, it destacks from top down. We
Electronics Forum | Thu Jul 16 10:40:12 EDT 2015 | migliore
Hi, Question 1: can anyone explain me what the VIA ASPECT RATIO is? Question 2: Let's say that a PCB manufacturer specifies a VIA ASPECT RATIO of 8:1. Can I have vias of drill diameter of 0.1 mm on a 2L board 1.6 thick? thanks, Enrico Migliore
Electronics Forum | Tue Oct 27 11:30:57 EDT 2015 | atekcare
Didn't see if anyone responded to your question offline, but if you are still evaluating laser depanelers, we would like to help? Here are just a few key factors to consider. (1) what material are you cutting? (2) what is the material thickness (3)
Electronics Forum | Mon Jul 11 10:59:50 EDT 2016 | mnorthey
Other problems on previous machines that we have experienced is that there was not enough board support under the panel or that the panel thickness was inaccurate. Both situations can cause parts to bounce off the PCB or not to be pushed into the pas
Electronics Forum | Tue Dec 20 11:14:53 EST 2016 | horchak
Why so small assuming your inserting a thru hole component. And if it is for a component what is the lead diameter and board thickness, and layer count? This all needs to be considered for manufacturability. A good board house should have no issues w
Electronics Forum | Mon Feb 06 22:38:46 EST 2017 | david_chiu
No matter in selective soldering or wave soldering process, higher pot temperature and longer wetting time can increase IMC thickness and joint strength(reliability), but as Daivf said, you need to care if the DIP component and bare PCB was damaged b
Electronics Forum | Wed Oct 09 16:15:18 EDT 2019 | cbart
when you say Kapton sheets assume you mean flex boards? are you using pallets to process them? Do you think the issue is the parts are being dropped above these deformations? how does the board print? are you getting good solder deposits from screen
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